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參數(shù)資料
| 型號(hào)： | μPD750066 |
| 廠商： | NEC Corp. |
| 英文描述： | 4 Bit Single Chip Microcontrollers(4位單片微控制器) |
| 中文描述： | 4位單片微控制器（4位單片微控制器） |
| 文件頁數(shù)： | 72/82頁 |
| 文件大?。?/td> | 376K |
| 代理商： | ΜPD750066 |
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m
PD750064, 750066, 750068, 750064(A), 750066(A), 750068(A)
72
15. RECOMMENDED SOLDERING CONDITIONS
Solder the
m
PD750068 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 15-1. Soldering Conditions of Surface Mount Type
m
PD750064GT-
m
PD750066GT-
m
PD750068GT-
m
PD750064GT(A)-
m
PD750066GT(A)-
m
PD750068GT(A)-
￥￥￥
￥￥￥
￥￥￥
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
￥￥￥
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
￥￥￥
: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
￥￥￥
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235 °C, Reflow time: 30 seconds or below
(210 °C or higher), Number of reflow processes: 2 max.
IR35-00-2
VPS
Package peak temperature: 215 °C, Reflow time: 40 seconds or below
(200 °C or higher), Number of reflow processes: 2 max.
VP15-00-2
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120 °C or below (package surface temperature)
WS60-00-1
Pin partial heating
Pin temperature: 300 °C or below, Time: 3 seconds or below (per side of device)
—
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Table 15-2. Soldering Conditions of Through Hole Type
m
PD750064CU-
m
PD750066CU-
m
PD750068CU-
m
PD750064CU(A)-
m
PD750066CU(A)-
m
PD750068CU(A)-
￥￥￥
￥￥￥
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
￥￥￥
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder temperature: 260 °C or below, Flow time: 10 seconds or below
Pin partial heating
Pin temperature: 300 °C or below, Time: 3 seconds or below (per pin)
Caution
In wave soldering, apply solder only to the pins. Care must be taken that
jet solder does not come in contact with the main body of the package.
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