- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382787 > μPD780306Y (NEC Corp.) 8 Bit Single Chip Microcontrollers(8位單片微控制器) PDF資料下載
參數(shù)資料
| 型號(hào)： | μPD780306Y |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁(yè)數(shù)： | 62/72頁(yè) |
| 文件大?。?/td> | 531K |
| 代理商： | ΜPD780306Y |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)當(dāng)前第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)
62
μ
PD780306Y, 780308Y
13. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD780306Y and 780308Y should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 13-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD780306YGF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
μ
PD780308YGF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times:
Once, Preheating temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
WS60-00-1
Partial heating
—
(2)
μ
PD780306YGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
μ
PD780308YGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Twice max.
VP15-00-2
Partial heating
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
—
Caution Use of more than one soldering method should be avoided (except in the case of partial heating).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPD780308Y | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD780306 | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD78042F | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD78P0018Y | 8 Bit Single Chip Microcontrollers |
| μPD78P014B | 8 Bit Single Chip Microcontrollers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PD780308 | 制造商:NEC 制造商全稱:NEC 功能描述:8-BIT SINGLE-CHIP MICROCOMPUTER |
| PD780336GC-XXX-9EV | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller |
| PD7-80-70A | 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:0 , 75 ohm POWER DIVIDERS / COMBINERS |
| PD784054GCA2 | 制造商:NEC 制造商全稱:NEC 功能描述:16-BIT SINGLE-CHIP MICROCONTROLLER |
| PD784976A | 制造商:NEC 制造商全稱:NEC 功能描述:16-Bit Single-Chip Microcontroller |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。