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| 型號(hào)： | μPD78053(A) |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁(yè)數(shù)： | 68/76頁(yè) |
| 文件大小： | 386K |
| 代理商： | ΜPD78053(A) |
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68
μ
PD78052(A), 78053(A), 78054(A)
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Table 14-1. Surface Mounting Type Soldering Conditions
μ
PD78052GC(A)-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm)
μ
PD78053GC(A)-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm)
μ
PD78054GC(A)-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm)
IR35-00-3
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (at 210
°
C or
higher), Number of reflow processes: 3 max.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (at 200
°
C or
higher), Number of reflow processes: 3 max.
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of
flow processes: once, Preheating temperature: 120
°
C or below (package surface
temperature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per device side)
Soldering Conditions
Soldering
Method
Infrared reflow
Symbol
VPS
Wave soldering
Pin partial heating
VP15-00-3
WS60-00-1
—
Caution
Use of more than one soldering method should be avoided (except for the pin partial heating
method).
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