參數(shù)資料
型號: μPD78056Y
廠商: NEC Corp.
英文描述: 8Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述: 8位單芯片微控制器(8位單片微控制器)
文件頁數(shù): 67/74頁
文件大?。?/td> 574K
代理商: ΜPD78056Y
67
μ
PD78052Y, 78053Y, 78054Y, 78055Y, 78056Y, 78058Y
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For a detailed description of recommended soldering conditions, refer to the information document
Semiconduc-
tor Device Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 14-1. Surface Mounting Type Soldering Conditions
μ
PD78052YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78053YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78054YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78055YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78056YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78058YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of times:
once, Preheating temperature : 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering Method
IR35-00-2
VP15-00-2
WS60-00-1
Recommended
Condition Symbol
Caution
Avoid as much as possible combining two or more soldering methods (except for the partial
heating method).
相關(guān)PDF資料
PDF描述
μPD78052Y 8Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78053Y 8Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78054Y 8Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78055Y 8Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78058Y 8Bit Single Chip Microcontrollers(8位單片微控制器)
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