參數(shù)資料
型號： μPD78063(A)
廠商： NEC Corp.
英文描述： 8 Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述： 8位單片機(jī)微控制器（8位單片微控制器）
文件頁數(shù)： 61/68頁
文件大?。?/td> 539K
代理商： ΜPD78063(A)
61
μ
PD78062(A), 78063(A), 78064(A)
13. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78062(A)/78063(A)/78064(A) should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 13-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78062GC(A)-
×××
-7EA : 100-pin plastic QFP (Fine pitch)
μ
PD78063GC(A)-
×××
-7EA : 100-pin plastic QFP (Fine pitch)
μ
PD78064GC(A)-
×××
-7EA : 100-pin plastic QFP (Fine pitch)
(14
×
14mm, resin thickness: 1.45 mm)
(14
×
14mm, resin thickness: 1.45 mm)
(14
×
14mm, resin thickness: 1.45 mm)
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
<precaution>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
<precaution>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
Soldering
Method
Soldering Conditions
Infrared reflow
VPS
Partial heating
IR35-107-2
VP15-107-2
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65% RH.
(2)
μ
PD78062GF(A)-
×××
-3BA : 100-pin plastic QFP (14
×
20 mm)
μ
PD78063GF(A)-
×××
-3BA : 100-pin plastic QFP (14
×
20 mm)
μ
PD78064GF(A)-
×××
-3BA : 100-pin plastic QFP (14
×
20 mm)
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Thrice max.
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Thrice max.
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
Soldering
Method
Soldering Conditions
IR35-00-3
VP15-00-3
WS60-00-1
—
Infrared reflow
VPS
Wave soldering
Partial heating
Cautions 1.
Use of more than one soldering method should be avoided (except in the case of partial heating).
2.
The
μ
PD78062GC(A)-
×××
-8EU, 78063GC(A)-
×××
-8EU, and 78064GC(A)-
×××
-8EU are under planning.
Therefore, soldering conditions for these products have not been specified.
相關(guān)PDF資料
PDF描述
μPD78064(A) 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78062Y 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78063Y 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78064Y 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD78062 8 Bit Single Chip Microcontrollers(8位單片微控制器)
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