參數(shù)資料
型號(hào)： μPD78064
廠商： NEC Corp.
元件分類(lèi)： 8位微控制器
英文描述： 8 Bit Single Chip Microcontrollers
中文描述： 8位單片機(jī)微控制器
文件頁(yè)數(shù)： 60/68頁(yè)
文件大?。?/td> 444K
代理商： ΜPD78064
60
m
PD78062, 78063, 78064
13. RECOMMENDED SOLDERING CONDITIONS
The
m
PD78062/78063/78064 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 13-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
m
PD78062GC-
￥￥￥
-7EA : 100-pin plastic QFP (Fine pitch)
m
PD78062GC-
￥￥￥
-8EU : 100-pin plastic LQFP (Fine pitch)
m
PD78063GC-
￥￥￥
-7EA : 100-pin plastic QFP (Fine pitch)
m
PD78063GC-
￥￥￥
-8EU : 100-pin plastic LQFP (Fine pitch)
m
PD78064GC-
￥￥￥
-7EA : 100-pin plastic QFP (Fine pitch)
m
PD78064GC-
￥￥￥
-8EU : 100-pin plastic LQFP (Fine pitch)
(14
￥
14mm, resin thickness: 1.45 mm)
(14
￥
14mm, resin thickness: 1.40 mm)
(14
￥
14mm, resin thickness: 1.45 mm)
(14
￥
14mm, resin thickness: 1.40 mm)
(14
￥
14mm, resin thickness: 1.45 mm)
(14
￥
14mm, resin thickness: 1.40 mm)
Package peak temperature: 235°C, Duration: 30 sec. max. (at 210°C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125°C)
<precaution>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Package peak temperature: 215°C, Duration: 40 sec. (at 200°C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125°C)
<precaution>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Pin temperature: 300°C max. Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
Soldering
Method
Soldering Conditions
Infrared reflow
VPS
Partial heating
IR35-107-2
VP15-107-2
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25°C, 65% RH.
(2)
m
PD78062GF-
￥￥￥
-3BA : 100-pin plastic QFP (14
￥
20 mm)
m
PD78063GF-
￥￥￥
-3BA : 100-pin plastic QFP (14
￥
20 mm)
m
PD78064GF-
￥￥￥
-3BA : 100-pin plastic QFP (14
￥
20 mm)
Package peak temperature: 235°C, Duration: 30 sec. max. (at 210°C or above),
Number of times: Thrice max.
Package peak temperature: 215°C, Duration: 40 sec. (at 200°C or above),
Number of times: Thrice max.
Solder bath temperature: 260°C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120°C max. (Package surface temperature)
Pin temperature: 300°C max. Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
Soldering
Method
Soldering Conditions
IR35-00-3
VP15-00-3
WS60-00-1
—
Infrared reflow
VPS
Wave soldering
Partial heating
Caution Use of more than one soldering method should be avoided (except in the case of partial heating).
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