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參數(shù)資料
| 型號： | μPD78074B |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 69/76頁 |
| 文件大小： | 568K |
| 代理商： | ΜPD78074B |
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69
μ
PD78074B, 78075B
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (at 210
°
C
or higher), Number of reflow processes: three or less
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (at 200
°
C
or higher), Number of reflow processes: three or less
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of
flow processes: once, Preheating temperature: 120
°
C or below (package surface
temperature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per device side)
Soldering Conditions
Symbol
IR35-00-3
Infrared reflow
VPS
VP15-00-3
Soldering
Method
Wave
soldering
WS60-00-1
Pin partial
heating
—
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (at 210
°
C
or higher), Number of reflow processes: two or less
Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C for 10
hours)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (at 200
°
C
or higher), Number of reflow processes: two or less
Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C for 10
hours)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per device side)
IR35-107-2
Infrared reflow
Soldering
Method
Soldering Conditions
Symbol
VP15-107-2
VPS
Pin partial
heating
—
14. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78074B and 78075B should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, consult our sales representative.
Table 14-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD78074BGF-
×××
-3BA
μ
PD78075BGF-
×××
-3BA
: 100-pin plastic QFP (14
×
20 mm, resin thickness 2.7 mm)
: 100-pin plastic QFP (14
×
20 mm, resin thickness 2.7 mm)
(2)
μ
PD78074BGC-
×××
-7EA
μ
PD78075BGC-
×××
-7EA
: 100-pin plastic QFP (fine pitch) (14
×
14 mm, resin thickness 1.45 mm)
: 100-pin plastic QFP (fine pitch) (14
×
14 mm, resin thickness 1.45 mm)
Note
Exposure limit after dry-pack is opened. Storage conditions: temperature of 25
°
C and relative humidity of 65%
or less.
Caution
Use of more than one soldering method should be avoided (except for the pin partial heating
method).
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