參數(shù)資料
型號(hào)： μPD78081(A)
廠商： NEC Corp.
英文描述： 8 Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述： 8位單片機(jī)微控制器（8位單片微控制器）
文件頁(yè)數(shù)： 51/60頁(yè)
文件大小： 302K
代理商： ΜPD78081(A)
51
μ
PD78081(A), 78082(A)
12. RECOMMENDED SOLDERING CONDITIONS
μ
PD78081(A) and 78082(A) should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, consult our sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
μ
PD78081GB(A)-
×××
-3B4
μ
PD78082GB(A)-
×××
-3B4
μ
PD78081GB(A2)-
×××
-3B4
:
44-pin plastic QFP (10
×
10 mm)
:
44-pin plastic QFP (10
×
10 mm)
:
44-pin plastic QFP (10
×
10 mm)
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (at 210
°
C or
higher), Number of reflow processes: 3 max.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (at 200
°
C or
higher), Number of reflow processes: 3 max.
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of flow
processes: once, Preheating temperature: 120
°
C or below (package surface tem-
perature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per device side)
Soldering Conditions
Symbol
IR35-00-3
Soldering
Method
Wave soldering
VPS
Infrared reflow
—
WS60-00-1
VP15-00-3
Pin partial heating
Cautions 1. Use of more than one soldering method should be avoided (except for the pin partial heating
method).
2. Because production of the
μ
PD78081GB(A)-
×××
-3BS-MTX and 78082GB(A)-
×××
-3BS-MTX is still
in a planning stage, their soldering conditions are pending.
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