參數(shù)資料
型號： μPD78P058
廠商： NEC Corp.
英文描述： 8 Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述： 8位單片機(jī)微控制器（8位單片微控制器）
文件頁數(shù)： 74/86頁
文件大小： 502K
代理商： ΜPD78P058
74
μ
PD78P054, 78P058
Table 12-1. Surface Mount Type Soldering Conditions (2/2)
(3)
μ
PD78P058GC-8BT : 80-pin plastic QFP (14
×
14 mm, resin thickness: 1.4 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-107-2
VPS
VP15-107-2
Wave soldering
WS60-107-1
Pin partial heating
—
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (210
°
C or
higher), Number of reflow processes: 2 max., Exposure limit: 7 days
Note
(after that,
prebaking is necessary at 125
°
C for 10 hours)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (200
°
C or
higher), Number of reflow processes: 2 max., Exposure limit: 7 days
Note
(after that,
prebaking is necessary at 125
°
C for 10 hours)
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of
flow processes: 1, Preheating temperature: 120
°
C or below (package surface
temperature), Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C
for 10 hours)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per side of device)
Note
The number of days for storage after the dry pack has been opened. Storage conditions are 25
°
C and 65%
RH max.
Caution
Use of more than one soldering method should be avoided (except in the case of pin partial
heating method).
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