參數(shù)資料
型號(hào): 0402YY103K2700J
英文描述: KONDENSATOR 10NF 16V 10ST
中文描述: KONDENSATOR 10NF 16V的10ST
文件頁(yè)數(shù): 37/46頁(yè)
文件大?。?/td> 659K
代理商: 0402YY103K2700J
41
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
Pad overlap 0.5mm beneath component.
Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
D1
D2
D3
D4
D5
Case Size
D1
D2
D3
D4
D5
0402
1.70 (0.07)
0.60 (0.02)
0.50 (0.02)
0.60 (0.02)
0.50 (0.02)
0603
2.30 (0.09)
0.80 (0.03)
0.70 (0.03)
0.80 (0.03)
0.75 (0.03)
0805
3.00 (0.12)
1.00 (0.04)
1.25 (0.05)
1206
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
1.60 (0.06)
1210
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
2.50 (0.10)
1808
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
2.00 (0.08)
1812
5.60 (0.22)
1.00 (0.04))
3.60 (0.14)
1.00 (0.04)
3.00 (0.12)
1825
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
6.35 (0.25)
2220
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
5.00 (0.20)
2225
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
6.35 (0.25)
Dimensions in millimeters (inches)
REFLOW SOLDERING
相關(guān)PDF資料
PDF描述
06033C103KAT2A KONDENSATOR 10NF 50V 10ST
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