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參數(shù)資料
| 型號： | 0603LWCT |
| 廠商： | 赫備國際貿(mào)易（上海）有限公司 |
| 英文描述： | SURFACE MOUNT DEVICE LED |
| 中文描述： | 表面貼裝器件的LED |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 692K |
| 代理商： | 0603LWCT |
SURFACE MOUNT DEVICE LED
Part No. : 0603LWCT
Bin Code List
Luminous Intensity(IV), Unit:mcd@5mA
Forward Voltage(VF), Unit:V@5mA
Bin Code
Min
Max
Bin Code
Min
Max
N
28.0
45.0
12
2.70
2.80
P
45.0
71.0
13
2.80
2.90
14
2.90
3.00
Tolerance of each bin are±15%
Tolerance of each bin are±0.1Volt
CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment(such
as office
equipment, communication equipment and household application).Consult
HB’s sales in
advance for information on application in which exceptional quality and reliability are required,
particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such
as airplanes, automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used
within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
performed consecutively cooling process is required between 1st and 2nd soldering processes.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 8
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