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參數(shù)資料
| 型號(hào)： | 0722MG |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源模塊 |
| 英文描述： | 2-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封裝： | 27.90 X 27.90 MM, 7.60 MM HEIGHT, CERAMIC, DIP-20 |
| 文件頁數(shù)： | 3/10頁 |
| 文件大?。?/td> | 174K |
| 代理商： | 0722MG |
722
2
SBVS016B
www.ti.com
SPECIFIED
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
PACKAGE-LEAD
DESIGNATOR
RANGE(2)
MARKING
NUMBER
MEDIA, QUANTITY
722
DIP-20
JND
–25
°C to +85°C
722
722G
Rails, 17
722BG
DIP-20
JND
–25
°C to +85°C
722BG
Rails, 17
722MG
DIP-20
JND
–25
°C to +85°C
722MG
Rails, 17
PACKAGE/ORDERING INFORMATION(1)
NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com. (2) –25
°C to +60°C for 16mA ≤ I
LOAD ≤ 40mA per output.
Supply Voltage, V+ to V– ..................................................................... 16V
Input Current ................................................................................... 275mA
Operating Temperature .................................................... –25
°C to +80°C
Storage Temperature ...................................................... –55
°C to +125°C
Junction Temperature ..................................................... –55
°C to +125°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
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