參數(shù)資料
型號(hào): 0736560001
廠商: MOLEX INC
元件分類: 電源輸入模塊
英文描述: 3 CONTACT(S), FEMALE, POWER CONNECTOR, PRESS FIT, RECEPTACLE
封裝: HALOGEN FREE AND ROHS COMPLIANT
文件頁數(shù): 1/2頁
文件大小: 33K
代理商: 0736560001
This document was generated on 11/06/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Overview:
Description:
2.00mm (.079") Pitch HDM Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 3 Circuits
Documents:
General
Product Family
Backplane Connectors
Series
Application
Backplane
Comments
Midplane Power Module, Molex Series 73659
Component Type
Power Header
Overview
HDM®
Product Name
HDM
Style
N/A
Physical
Circuits (Loaded)
3
Circuits (maximum)
3
Color - Resin
Black
Durability (mating cycles max)
250
First Mate / Last Break
No
Flammability
94V-0
Guide to Mating Part
No
Keying to Mating Part
None
Material - Metal
Beryllium Copper
Material - Plating Mating
Gold
Material - Plating Termination
Tin-Lead
Material - Resin
High Temperature Thermoplastic
Number of Columns
1
Number of Pairs
Open Pin Field
Number of Rows
3
Orientation
Vertical
PC Tail Length (in)
0.138 In
PC Tail Length (mm)
3.50 mm
PCB Locator
No
PCB Retention
Yes
PCB Thickness Recommended (in)
0.098 In
PCB Thickness Recommended (mm)
2.50 mm
Packaging Type
Tube
Pitch - Mating Interface (in)
0.000 In
Pitch - Mating Interface (mm)
0.00 mm
Plating min: Mating (in)
30
Plating min: Mating (m)
0.75
Plating min: Termination (in)
35.2
Plating min: Termination (m)
0.88
Polarized to PCB
Yes
Stackable
No
Surface Mount Compatible (SMC)
No
Temperature Range - Operating
-55°C to +105°C
Termination Interface: Style
Through Hole - Compliant Pin
Series image - Reference only
RoHS Compliant by
Exemption
Contains SVHC: No
Halogen-Free
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73656 Series
Mates With
73651 HDM Board-to-Board
Daughterboard Power Module
Application Tooling
| FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
Flat Rock Tooling for
Pneumatic Press
相關(guān)PDF資料
PDF描述
0736560180 2 CONTACT(S), FEMALE, POWER CONNECTOR, PRESS FIT, RECEPTACLE
0736560181 2 CONTACT(S), FEMALE, POWER CONNECTOR, PRESS FIT, RECEPTACLE
0736560190 1 CONTACT(S), FEMALE, POWER CONNECTOR, PRESS FIT, RECEPTACLE
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0736561001 3 CONTACT(S), FEMALE, POWER CONNECTOR, PRESS FIT, RECEPTACLE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
0736560180 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.00mm (.079") Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76μm (30μ")
0736560181 制造商:MOLEX 制造商全稱:Molex Electronics Ltd. 功能描述:2.00mm (.079") Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 2 Circuits, Tin
0736560190 功能描述:HDM BP PWR MOD CUST. LOAD RoHS:是 類別:連接器,互連式 >> 背板 - 專用 系列:HDM®(高密度)73656 標(biāo)準(zhǔn)包裝:260 系列:Impact™ 76155 連接器用途:中平面 連接器類型:接頭,公引腳 連接器類型:Impact? 位置數(shù):96 加載位置的數(shù)目:全部 間距:0.053"(1.35mm) 行數(shù):12 列數(shù):8 安裝類型:通孔 端子:壓配式 觸點(diǎn)布局,典型:32 差分對(duì) 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:30µin(0.76µm) 顏色:黑 包裝:托盤 額定電流:- 材料可燃性額定值:UL94 V-0 工作溫度:-55°C ~ 85°C 額定電壓:30V 其它名稱:76155-1835761551835
0736561000 制造商:Molex 功能描述:Conn Hard Metric RCP 3Power POS Press Fit ST Thru-Hole Tube 制造商:Molex 功能描述:CONN PWR F 3 POS 2MM PRESS ST TH - Rail/Tube
0736561001 功能描述:2MM HDM BP PW PF 30AU 3CKT RoHS:否 類別:連接器,互連式 >> 背板 - 專用 系列:HDM®(高密度)73656 標(biāo)準(zhǔn)包裝:260 系列:Impact™ 76155 連接器用途:中平面 連接器類型:接頭,公引腳 連接器類型:Impact? 位置數(shù):96 加載位置的數(shù)目:全部 間距:0.053"(1.35mm) 行數(shù):12 列數(shù):8 安裝類型:通孔 端子:壓配式 觸點(diǎn)布局,典型:32 差分對(duì) 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:30µin(0.76µm) 顏色:黑 包裝:托盤 額定電流:- 材料可燃性額定值:UL94 V-0 工作溫度:-55°C ~ 85°C 額定電壓:30V 其它名稱:76155-1835761551835