參數(shù)資料
型號(hào): 08055C332K-MR
英文描述: CAP. 3.3NF MINIREEL 500PCS
中文描述: 第。 3.3NF MINIREEL 500件
文件頁(yè)數(shù): 9/12頁(yè)
文件大?。?/td> 328K
代理商: 08055C332K-MR
41
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
Pad overlap 0.5mm beneath component.
Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
D1
D2
D3
D4
D5
Case Size
D1
D2
D3
D4
D5
0402
1.70 (0.07)
0.60 (0.02)
0.50 (0.02)
0.60 (0.02)
0.50 (0.02)
0603
2.30 (0.09)
0.80 (0.03)
0.70 (0.03)
0.80 (0.03)
0.75 (0.03)
0805
3.00 (0.12)
1.00 (0.04)
1.25 (0.05)
1206
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
1.60 (0.06)
1210
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
2.50 (0.10)
1808
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
2.00 (0.08)
1812
5.60 (0.22)
1.00 (0.04))
3.60 (0.14)
1.00 (0.04)
3.00 (0.12)
1825
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
6.35 (0.25)
2220
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
5.00 (0.20)
2225
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
6.35 (0.25)
Dimensions in millimeters (inches)
REFLOW SOLDERING
相關(guān)PDF資料
PDF描述
08055C333K-MR CAP. 33NF MINIREEL 500PCS
08055C471K-MR CAP. 470PF MINIREEL 500PCS
06035C332K-MR CAP. 3.3NF MINIREEL 500PCS
06035C471K-MR CAP. 470PF MINIREEL 500PCS
06035G103Z-MR CAP. 10NF MINIREEL 500PCS
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