參數(shù)資料
型號(hào)： 0805B104K500N
廠商： Electronic Theatre Controls, Inc.
英文描述： CERAMIC MULTILAYER CAPACITORS
中文描述： 多層陶瓷電容器
文件頁(yè)數(shù)： 51/52頁(yè)
文件大?。?/td> 2571K
代理商： 0805B104K500N
CHIP SELECTION
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature, or “temperature coefficient”,
as these devices vary in behavior over temperature. The choice
of component is thus largely determined by the temperature
stability required of the device, i.e. type of dielectric, and the size
necessary for a given capacitance and voltage rating. The following
items are pertinent to chip selection:
DIELECTRIC TYPE
COG: Ultra stable Class I dielectric, with negligible dependence of
electrical properties on temperature, voltage, frequency and time.
Used in circuitry requiring very stable performance.
X7R: Stable Class II dielectric, with predictable change in properties
with temperature, voltage, frequency and time. Used as blocking,
de-coupling, bypassing and frequency discriminating elements. This
dielectric is ferroelectric, and provides higher capacitance than Class I
Z5U/Y5V: General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties with temperature and
test conditions. Very high capacitance per unit volume is attainable for
general purpose applications where stability is not important.
CAPACITOR SIZE
Size selection is based primarily on capacitance value and voltage rat-
ing. Smaller units are generally less expensive; 0805 is the most eco-
nomical size. Because mass affects the thermal shock behavior of
chips, size selection must consider the soldering method used to
attach the chip to the board. Sizes 1812 and smaller can be wave,
vapor phase or reflow soldered. Larger units require reflow soldering.
TERMINATION MATERIAL
Nickel barrier termination, with exceptional solder leach resistance is
recommended for all applications involving solder. Silver palladium
termination is required for epoxy attachment, also for solder reflow
below 230°C . Silver termination, which is most ductile, yet leaches
readily in solder, is often preferred for units to be leaded, to minimize
thermal cycle stresses.
PACKAGING
Units are available in bulk, reeled or in waffle pack. Bar coding is
optional.
6
ATTACHMENT METHODS
Bonding of capacitors to substrates can be categorized into two
methods, those involving solder, which are prevalent, and those
using other materials, such as epoxies and thermo-compression or
ultrasonic bonding with wire.
SOLDERING
Soldering methods commonly used in the industry and recom-
mended are Reflow Soldering, Wave Soldering, and to a lesser
extent, Vapor Phase Soldering. All these methods involve thermal
cycling of the components and therefore the rate of heating and
cooling must be controlled to preclude thermal shocking of the
devices. In general, rates which do not exceed 100°C per minute
and a
T spike of 100°C maximum for any soldering process is
advisable. Other precautions include post soldering handling,
primarily avoidance of rapid cooling with contact with heat sinks,
such as conveyors or cleaning solutions.
Large chips are more prone to thermal shock as their greater bulk
will result in sharper thermal gradients within the device during
thermal cycling. Units larger than 1812 experience excessive stress
if processed through the fast cycles typical of solder wave or vapor
phase operations. Solder reflow is most applicable to the larger
chips as the rates of heating and cooling can be slowed within safe
limits.
Attachment using a soldering iron requires extra care, particularly
with large components, as thermal gradients are not easily
controlled and may cause cracking of the chip. Precautions include
preheating of the assembly to within 100°C of the solder flow
temperature, the use of a fine tip iron which does not exceed 30
watts, and limitation of contact of the iron to the circuit pad areas
only.
BONDING
Hybrid assembly using conductive epoxy or wire bonding requires
the use of silver palladium or gold terminations. Nickel barrier
termination is not practical in these applications, as an increase in
ESR results.
CLEANING
Chip capacitors can withstand common agents such as
water, alcohol and degreaser solvents used for clean-
ing boards. Ascertain that no flux residues are left
on the chip surfaces as these diminish
electrical performance.
APPLICA TION
NOTES
相關(guān)PDF資料
PDF描述
0805B104xxx Multilayer Ceramic Chip Capacitors Products NPO, X7R, Y5V
0805CG101J9AB KONDENSATOR 100PF 50V 10ST
0805CG221J9AB KONDENSATOR 220PF 50V 10ST
0805CG471J9AB KONDENSATOR 470PF 50V 10ST
0805CS-020XJBB OBSOLETE when inventory is depleted. Change second to last letter to 'L' for new RoHS part number. Terminals never contained lead.
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
0805B104K500NT 功能描述:多層陶瓷電容器MLCC - SMD/SMT .10uF 50V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
0805B104K500P 功能描述:CAP CER 制造商:knowles novacap 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 電容:0.1μF 容差:±10% 電壓 - 額定:50V 溫度系數(shù):X7R 工作溫度:-55°C ~ 125°C 特性:環(huán)氧樹(shù)脂封裝 等級(jí):- 應(yīng)用:旁通，去耦 故障率:- 安裝類型:表面貼裝，MLCC 封裝/外殼:0805（2012 公制） 大小/尺寸:0.080" 長(zhǎng) x 0.050" 寬（2.03mm x 1.27mm） 高度 - 安裝（最大值）:- 厚度（最大值）:0.054"（1.37mm） 引線間距:- 引線形式:- 標(biāo)準(zhǔn)包裝:1
0805B105K100CT 制造商:Walsin Technology Corporation 功能描述: 制造商:Walsin Technology Corporation 功能描述:0805 X7R 1 uF 10 V 10 % Tolerance Surface Mount Multilayer Ceramic Capacitor 制造商:Walsin Technology Corporation 功能描述:0805 X7R 1 uF 10 V ?10 % Tolerance Surface Mount Multilayer Ceramic Capacitor
0805B105K160CT 制造商:Walsin Technology Corporation 功能描述:
0805B105K250CT 制造商:Walsin Technology Corporation 功能描述:
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