參數(shù)資料
型號(hào): 0805YG105Z-MR
英文描述: CAP. 1UF MINIREEL 500PCS
中文描述: 第。 1uF的MINIREEL 500件
文件頁數(shù): 9/12頁
文件大?。?/td> 328K
代理商: 0805YG105Z-MR
41
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
Pad overlap 0.5mm beneath component.
Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
D1
D2
D3
D4
D5
Case Size
D1
D2
D3
D4
D5
0402
1.70 (0.07)
0.60 (0.02)
0.50 (0.02)
0.60 (0.02)
0.50 (0.02)
0603
2.30 (0.09)
0.80 (0.03)
0.70 (0.03)
0.80 (0.03)
0.75 (0.03)
0805
3.00 (0.12)
1.00 (0.04)
1.25 (0.05)
1206
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
1.60 (0.06)
1210
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
2.50 (0.10)
1808
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
2.00 (0.08)
1812
5.60 (0.22)
1.00 (0.04))
3.60 (0.14)
1.00 (0.04)
3.00 (0.12)
1825
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
6.35 (0.25)
2220
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
5.00 (0.20)
2225
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
6.35 (0.25)
Dimensions in millimeters (inches)
REFLOW SOLDERING
相關(guān)PDF資料
PDF描述
0805ZC105K-MR CAP. 1UF MINIREEL 500PCS
934056280127 47 A, 55 V, 0.024 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
934056286118 47 A, 55 V, 0.024 ohm, N-CHANNEL, Si, POWER, MOSFET
934056281127 46 A, 55 V, 0.026 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
934056287118 46 A, 55 V, 0.026 ohm, N-CHANNEL, Si, POWER, MOSFET
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