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參數(shù)資料
| 型號： | 10-10-1033 |
| 英文描述： | BUCHSENLEISTE 5.08MM 3POL |
| 中文描述： | BUCHSENLEISTE 5.08MM 3POL |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 57K |
| 代理商： | 10-10-1033 |
MX01
J
PCB
and
Wire
Connectors
J-131
FEATURES AND SPECIFICATIONS
5.08mm (.200") Pitch
KK
PC Board Connector
3002
Top Entry
Mount Style C
Features and Benets
s
Sizes 2 to 20 circuits
Reference Information
Product Specication: PSX10-39
Packaging: Tray
UL File No.: E29179
CSA File No.: LR19980
Mates With: 2599, 3003 and 3008 headers
Designed In: Inches
Electrical
Voltage: 250V
Current: 7.0A
Contact Resistance: 20m
max.
Dielectric Withstanding Voltage: 1500V
Insulation Resistance: 500K M
min.
Mechanical
Mating Force: 24 oz max.
Unmating Force: 4 oz min.
Normal Force: 350g
Durability: 25 cycles Tin
Physical
Housing: Nylon, UL 94V-2
Contact: Phosphor Bronze
Plating: 1
m Tin/Lead and 0.5m Gold
Operating Temperature: 0 to +75C
CATALOG DRAWING (FOR REFERENCE ONLY)
ORDERING INFORMATION AND DIMENSIONS
Circuits
Order No.
Dimension
Tin
Gold
A
B
2
10-10-1023
10-10-1028
10.16 (.400)
5.08 (.200)
3
10-10-1033
10-10-1038
15.24 (.600)
10.16 (.400)
4
10-10-1043
10-10-1048
20.32 (.800)
15.24 (.600)
5
10-10-1053
10-10-1058
25.40 (1.000)
20.32 (.800)
6
10-10-1063
10-10-1068
30.48 (1.200)
25.40 (1.000)
7
10-10-1073
10-10-1078
35.56 (1.400)
30.48 (1.200)
8
10-10-1083
10-10-1088
40.64 (1.600)
35.56 (1.400)
9
10-10-1093
10-10-1098
45.72 (1.800)
40.64 (1.600)
10
10-10-1103
10-10-1108
50.80 (2.000)
45.72 (1.800)
11
10-10-1113
10-10-1118
55.88 (2.200)
50.80 (2.000)
12
10-10-1123
10-10-1128
60.96 (2.400)
55.88 (2.200)
13
10-10-1133
10-10-1138
66.04 (2.600)
60.96 (2.400)
14
10-10-1143
10-10-1148
71.12 (2.800)
66.04 (2.600)
15
10-10-1153
10-10-1158
76.20 (3.000)
71.12 (2.800)
16
10-10-1163
10-10-1168
81.28 (3.200)
76.20 (3.000)
17
10-10-1173
10-10-1178
86.36 (3.400)
81.28 (3.200)
18
10-10-1183
10-10-1188
91.44 (3.600)
86.36 (3.400)
19
10-10-1193
10-10-1198
96.52 (3.800)
91.44 (3.600)
20
10-10-1203
10-10-1208
101.60 (4.000)
96.52 (3.800)
Circuits
Order No.
Dimension
Tin
Gold
A
B
Plating: 1.00 microns Tin/Lead /2.00 microns Copper min. (.000040" Tin/Lead /.000080" Copper min.) or
0.50 microns Gold/0.75 microns Nickel min. (.000020" Gold/.000030" Nickel min.)
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