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參數(shù)資料
| 型號： | 1018 |
| 英文描述： | Intermodulation in RF Coaxial Connectors |
| 中文描述： | 互調(diào)射頻同軸連接器 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 295K |
| 代理商： | 1018 |
Ensure, by design, a properly defined contact interface
at connector, panel and contact interfaces
Insufficient contact force will give rise to metal to
oxide junctions. The classic rectifiers were metal oxide
by composition.
Axial maximum material condition at the
connector interface is critical in order to ensure
minimum mismatch and maximum potential of a butt-
contact. Panel interfaces generally concern the
physical contact of the connector body to the panel. In
this case, it has been determined that a protruding
feature as close as possible to the body bore will give
the best IM performance. The applied mounting force
is concentrated in the surface area of the protrusion
which, on engagement with the panel, punctures the
existing oxide layer to give a metal-to-metal, gas-tight
junction.
Avoidance of crimps
Crimps, by nature, can only give multiple point-
contact rather than 360-degree contact and also cause a
variability in the position of electrical contact during
dynamic testing. IM products will therefore be greater.
It has been found that soldered center contacts and
clamp/solder outer contacts give the best static and
dynamic IM performance.
Improving IM Connector Design
M/A-COM continues to pursue design techniques
which improve intermodulation performance to address
emerging telecommunication market needs. A state of
the art intermodulation test facility and participation on
the international (IEC SC46D WG5) committee to
develop standard test practices ensures our commitment
to the understanding of intermodulation characteristics.
This applied technology base is instrumental in
developing innovative low intermodulation products for
7-16, Type N, SMA and OSP interfaces.
Most Commonly Asked Questions
Regarding Intermodulation
Why is intermodulation such a concern for cellular
infrastructure equipment
The primary concerns for cellular service providers
today are channel efficiency and clarity of transmission.
Growth in demand for mobile communications has
created a need to operate equipment at greater capacities
and reliability to service the competitive market.
Intermodulation degrades or limits the ability of the
service provider to operate at optimal levels of
performance and may ultimately cause subscribers to
experience poor call quality. Intermodulation has
become an important factor in system selection to ensure
the best possible network service.
Where is intermodulation most likely to occur in
cellular infrastructure equipment
Intermodulation is typically of greatest concern
between the filtering elements of the system and the
antenna. The introduction of higher power levels for the
transmit side of the equipment creates greater potential
for intermodulation to occur. This is why the majority of
focus for intermodulation concerns 7-16, type N, SMA
and 4.1/9.5 connector interfaces.
Is intermodulation a recent development
Intermodulation has always been inherently present
in RF coaxial connectors but may be relatively
imperceptible in some devices for a variety of reasons.
The amount of power applied to an RF connector
determines the relative IM threshold which can be
observed. Intermodulation is therefore more likely to
cause concern in a higher power system, for example,
utilizing a 7-16 connector interface rather than an
equivalent low power OSX solution. The trend toward
higher power digital cellular systems creates the need
for greater intermodulation sensitivity.
M/A-COM Division of AMP Incorporated
I
North America: Tel. (800) 366-2266, Fax (800) 618-8883
I
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
I
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
V4.00
1.
2.
3.
Effect of surface roughness
Fig. 5
1.5
0.5
0
-0.5
-1.5
-1
1
Oxide
Signal flow
Metal
Air
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