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參數(shù)資料
| 型號(hào)： | 1115XFREQ3BF |
| 廠商： | VECTRON INTERNATIONAL |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 24 MHz - 85 MHz, ACMOS OUTPUT |
| 封裝： | DIP-8/4 |
| 文件頁數(shù)： | 17/19頁 |
| 文件大小： | 1082K |
| 代理商： | 1115XFREQ3BF |
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
OS-68338
I
7
g. Internal Water-Vapor Content (RGA) samples and test performance
h. MTBF Reliability Calculations
i. Worst Case/Derating Analysis
j. Deliverable Process Identification Documentation (PID)
k. Customer Source Inspection (pre-cap / final)
5.3
Test Conditions. Unless otherwise stated herein, inspections are performed in accordance with
those specified in MIL-PRF-55310 and MIL-PRF-38534, in that order. Process travelers
identify the applicable methods, conditions and procedures to be used. Examples of electrical
test procedures that correspond to MIL-PRF-55310 requirements are shown in Table 3.
5.4
Special Tests and Descriptions.
5.4.1 Frequency-Temperature Slew. Frequency-Temperature Slew Test has been developed as an
indicator of higher than normal internal water vapor content. The incremental temperature
sweep from +125°C to -55°C and back to +125°C records output frequency fluctuations
emulating the mass loading of moisture deposited on the crystal blank surface. Though not
replacing a customer’s internal water-vapor content (RGA) requirement, confidence is
increased without destructively testing otherwise good devices.
5.4.2 Burn-in Delta Frequency Aging (in Option D). The frequency measurement for burn-in delta
measurements is performed at the crystal’s upper turning point temperature where its effects on
repeatable frequency accuracy are maximized. Dependent on the crystal specified, this
temperature is typically between +65°C and +85°C, ±0.2°C.
5.5
Deliverable Data. The manufacturer supplies the following data, as a minimum, with each lot
of devices:
a. Completed assembly and screening lot travelers, including rework history.
b. Electrical test variables data, identified by unique serial number.
c. Frequency-Temperature Slew plots, Radiographic films, Group C data and RGA data as
required by purchase order.
5.6
Discrepant Material. All MRB authority resides with the procuring activity.
5.7
Failure Analysis. Any catastrophic failure (no clocking, no current) at Post Burn-In or after
will be evaluated for root cause. The customer will be notified after occurrence and upon
completion of the evaluation.
6.
PREPARATION FOR DELIVERY
6.1
Packaging. Devices will be packaged in a manner that prevents handling and transit damage
during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1
devices.
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