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參數(shù)資料
| 型號： | 1761500-1 |
| 廠商： | Tyco Electronics |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | High Current SEC II Connectors |
| 中文描述： | High Current SEC II Connectors |
| 文件頁數(shù)： | 14/15頁 |
| 文件大?。?/td> | 1541K |
| 代理商： | 1761500-1 |
180
Catalog 1773096
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 2-10
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-(0)8002-67666
Card
Edge
Products
Power Connectors & Interconnection Systems
CROWN EDGE Card Edge-style High Current Connectors (Continued)
Design Notes
Mating PCB Requirements
Mating PCB edge fingers should be gold plated, have
.050" (1.3 mm) side margins, and be of suitable copper
weight for power applications. Mating board thickness is
.062 [1.60].
Sequenced Mating
Sequenced mating can be achieved by designing one or
more setback traces on the mating card edge, or by
notching the edge of the card.
End-to-end Mounting
CROWN EDGE modules can be placed end-to-end for
connector assemblies up to 8" (203.20 mm) long.
Hot-Plug Requirements
Hot-plug application of this product requires the use of the
CROWN EDGE true hot-plug modules (see part numbers
on pages 177-179) mated with a customer-supplied metal
blade or bus bar. Dimensions of a sample mating blade for
use with CROWN EDGE hot-plug modules is shown below.
Mating PC Card Edge Samples
The drawings below show two PC card edge samples with
signal and power lines designed to mate with 2 and 3-
segment CROWN EDGE modules.
Chamfer
Mating Edges
2 x 2 Segment Modules Provide Two
Sequenced Power Traces and 30 Signal Traces
2 x 3 Segment Modules Provide
Ground Plane and 12 Signal Lines
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 1761502-1 | 制造商:TE Connectivity 功能描述:MPGA959 SOCKET,SN-AG-CU SBALLS - Bulk |
| 1761503-1 | 功能描述:IC 與器件插座 MICRO PGA 940 POS RoHS:否 制造商:Molex 產品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 1761503-2 | 功能描述:IC 與器件插座 MPGA 939 30Au-DNA LF RoHS:否 制造商:Molex 產品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 1761504-1 | 制造商:TE Connectivity 功能描述:MPGA700,VISUAL IND,SN-AG-CU SB - Bulk |
| 1761505-1 | 功能描述:IC 與器件插座 MPGA 604P SMT SN-AG-CU RoHS:否 制造商:Molex 產品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
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