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參數(shù)資料
| 型號： | 1N5806D2B-JQRS.GCDE |
| 廠商： | SEMELAB LTD |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 1 A, 150 V, SILICON, SIGNAL DIODE |
| 封裝： | HERMETIC SEALED, CERAMIC, DLCC2 VARIANT B, 2 PIN |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 193K |
| 代理商： | 1N5806D2B-JQRS.GCDE |
ULTRAFAST RECOVERY
RECTIFIER DIODE
Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing orders.
Semelab plc
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Document Number 8318
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Issue 2
Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Page 1 of 4
1N5806D2A / 1N5806D2B
Hermetic Ceramic Package Designed as a Drop-
In Replacement for D-5A MELF Package
Designed For High Rel Applications
Screening Options Available
ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated)
VRRM
Maximum Reverse Repetitive Peak Voltage
150V
VRMS
Maximum RMS Voltage
105V
Vdc
Maximum DC Blocking Voltage
150V
IO
Maximum Rectified Current Io2 = TA +55°C (1)
1.0A
Derate above TA 55°C
8.33mA/°C
IFSM
Non Repetitive Forward Surge Current (2)
35A
TJ
Junction Temperature Range
-65 to +175°C
Tstg
Storage Temperature Range
-65 to +175°C
T
TT
THERMAL PROPERTIES
HERMAL PROPERTIES
Symbols
Parameters
Max.
Max. Units
Units
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP =25°C
34
°C/W
RθJA(PCB) Thermal Resistance, Junction To Ambient (3)
150
°C/W
Note
Notessss
(1) IO2 is rated at 1.0A @ TA = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 154°C/W.
(2) TA = 25°C @ IO=1.0A and VRWM for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.067” x 0.105”), (1.7mm x 2.76mm) , horizontal in still air.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1N5806E3 | 制造商:Microsemi Corporation 功能描述:1N5806E3 - Bulk |
| 1N5806E3/TR | 功能描述:UFR,FRR 制造商:microsemi corporation 系列:- 零件狀態(tài):在售 二極管類型:標(biāo)準(zhǔn) 電壓 - DC 反向（Vr）（最大值）:150V 電流 - 平均整流（Io）:2.5A 不同 If 時的電壓 - 正向（Vf:975mV @ 2.5A 速度:快速恢復(fù) = 200mA（Io） 反向恢復(fù)時間（trr）:25ns 不同?Vr 時的電流 - 反向漏電流:1μA @ 150V 不同?Vr，F(xiàn) 時的電容:25pF @ 10V，1MHz 安裝類型:通孔 封裝/外殼:A，軸向 供應(yīng)商器件封裝:A，軸向 工作溫度 - 結(jié):-65°C ~ 175°C 標(biāo)準(zhǔn)包裝:100 |
| 1N5806JANTX | 制造商:Microsemi Corporation 功能描述: |
| 1N5806JTXV | 制造商:SEM 功能描述: |
| 1N5806SM | 制造商:Semtech Corporation 功能描述: |
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