參數(shù)資料
型號(hào)： 20-101-0404
廠商： Rabbit Semiconductor
文件頁(yè)數(shù)： 62/80頁(yè)
文件大?。?/td> 0K
描述： MODULE RABBITCORE RCM2000
標(biāo)準(zhǔn)包裝： 1
系列： RabbitCore®
模塊/板類(lèi)型： MPU 核心模塊
適用于相關(guān)產(chǎn)品： RCM2000
產(chǎn)品目錄頁(yè)面： 620 (CN2011-ZH PDF)
其它名稱： 316-1083
User’s Manual
61
B.4.1 Adding Other Components
There is room on the Prototyping Board for a user-supplied RS-232 transceiver chip at
location U2 and a 10-pin header for serial interfacing to external devices at location J6. A
Maxim MAX232 transceiver is recommended. When adding the MAX232 transceiver at
position U2, you must also add 100 nF charge storage capacitors at positions C3–C6 as
shown in Figure B-7.
Figure B-7. Location for User-Supplied RS-232 Transceiver
and Charge Storage Capacitors
There are two sets of pads that can be used for surface mount prototyping SOIC devices.
The silk screen layout separates the rows into six 16-pin devices (three on each side).
However, there are pads between the silk screen layouts giving the user two 52-pin (2x26)
SOIC layouts with 50 mil pin spacing. There are six sets of pads that can be used for 3- to
6-pin SOT23 packages. There are also 60 sets of pads that can be used for SMT resistors
and capacitors in an 0805 SMT package. Each component has every one of its pin pads
connected to a hole in which a 30 AWG wire can be soldered (standard wire wrap wire can
be soldered in for point-to-point wiring on the Prototyping Board). Because the traces are
very thin, carefully determine which set of holes is connected to which surface mount pad.
+
C1
U1
J5
S2
S3
S1
RN1
D2
JP1
DS3
DS2
DS1
C2
U2
C3
C4
C5
J6
C6
RESET
S2
PB3
PB2
PA1
PA0
DS3
S3
DS2
PWR
GND
RXB
TXB
TXC
RXC
RS-232
MAX232
100 nF
storage
capacitors
相關(guān)PDF資料
PDF描述
345-030-540-204 CARDEDGE 30POS DUAL .100 GREEN
345-030-540-202 CARDEDGE 30POS DUAL .100 GREEN
345-030-540-201 CARDEDGE 30POS DUAL .100 GREEN
046232412008800+ CONN FPC R ANGLE 1.0 MM 12 POS
20-101-0357 COMPUTER SINGLE-BOARD BL1810
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