14
SMD type chip
Chip thermistors are specially processed, highly
reliable thermistors.
They can be face-bonded to act as thermal
compensators for ICs and they are manufactured
in sizes down to 1 square mm, they can also be
used to detect temperature with relatively small
time constants.
Precautions
Do not expose the thermistors to high
soldering heat for more than specified time.
(260 C for not longer than 10s is
recommended)
Dimensions
Reflow soldering profile
103 KT 2125T -
Rated zero-power resistance at 25 C 103:10k
Part number
Chip thermistor
1P: 1%,2P: 2%,3P: 3%
Dimension(EIAJ) 2125
Specifications
Part No.
R
25*1
B value*
2
Dissipation factor
(mW/ C)
1.0
0.9
0.9
0.9
0.7
Thermal time
constant(s)*
3
7.5
5.0
5.0
5.0
2.2
Operating temp.
range( C)
40 125
40 125
40 125
40 125
40 125
Rated power
at 25 C(mW)
5.0
4.5
4.5
4.5
3.5
*1 R
: Rated zero-power resistance value at 25 C.
*2 B value : determined by rated zero-power resistance at 25 C and 85 C.
*3 Time when thermistor temperature reaches 63.2% of the temperature difference. The value is measured in the air.
Other resistance is available, please ask.
103KT2125T
103KT1608T
503KT1608T
104KT1608T
103KT1005T
10k
10k
50k
100k
10k
3435K 1%
3435K 1%
4055K 1%
4390K 1%
3435K 1%
Unit(mm)
1.5
(1.0 0.1)
1.65 0.2
4.0 0.1
4.0 0.1
2.0 0.05
3
1
8
1.5max.
(0.25max.)
( ):1608type
0.3max.
0.1
0
2
(
Taping (2125, 1608 type)
Unit(mm)
L
L
1
L
1
W
Glass coating
Electrode
(Sn plated)
190 C 15 C
260 C 5 C
T
Time
Soldering
Cooling
Preheat(air)
120s 30s
C/s
10s
Minimum quantity:4000pcs/reel
Minimum quantity:10000pcs/reel
Unit(mm)
(1005 type)
T
EIA
0402
0603
0805
EIAJ
1005
1608
2125
L
1.00 0.15
1.60 0.15
2.00 0.20
W
0.50 0.10
0.80 0.15
1.25 0.20
T
0.6max.
0.95max.
1.2max.
L
1
0.15 0.30
0.20 0.50
0.20 0.50
2.0 0.05
0.66 0.03
0.9max
0.75 0.02
4.0 0.1
0.6 0.10
2.0 0.10
1
3
8
1.5
0.1
0
1
CHIP TYPE THERMISTOR