2
20ETS..S Series
Voltage Ratings
T
J
T
stg
Max. Junction Temperature Range
- 40 to 150
°C
Max. Storage Temperature Range
- 40 to 150
°C
Soldering Temperature
240
°C
for 10 seconds (1.6mm from case)
R
thJC
Max. Thermal Resistance Junction
to Case
R
thJA
Typ. Thermal Resistance Junction
to Ambient (PCB Mount)**
wt
Approximate Weight
1.3
°C/W
DC operation
40
°C/W
2 (0.07)
g (oz.)
T
Case Style
SMD-220
Thermal-Mechanical Specifications
Parameters
20ETS..S Units
Conditions
**When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140μm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
Part Number
Provide terminal coating for voltages above 1200V
V
RRM
, maximum
peak reverse voltage
V
V
RSM
, maximum non repetitive
peak reverse voltage
V
I
RRM
150°C
mA
20ETS08S
800
900
20ETS12S
1200
1300
1
20ETS16S
1600
1700
I
F(AV)
Max. Average Forward Current
I
FSM
Surge Current
20
A
50% duty cycle @ T
C
= 105° C, sinusoidal wave form
10ms Sine pulse, rated V
RRM
applied
10ms Sine pulse, no voltage reapplied
Max. Peak One Cycle Non-Repetitive
250
300
I
2
t
Max. I
2
t for fusing
316
10ms Sine pulse, rated V
RRM
applied
10ms Sine pulse, no voltage reapplied
442
I
2
√
t
Max. I
2
√
t for fusing
3160
A
2
√
s
t = 0.1 to 10ms, no voltage reapplied
Absolute Maximum Ratings
Parameters
20ETS..S
Units
Conditions
A
A
2
s
V
FM
r
t
V
F(TO)
Threshold voltage
Max. Forward Voltage Drop
1.1
V
@ 20A, T
J
= 25°C
Forward slope resistance
10.4
m
0.85
V
I
RM
Max. Reverse Leakage Current
0.1
T
J
= 25 °C
T
J
= 150 °C
1.0
Electrical Specifications
Parameters
20ETS..S
Units
Conditions
T
J
= 150°C
V
R
= rated V
RRM
mA
To Order
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