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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計中的應(yīng)用說明 |
| 文件頁數(shù)： | 12/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
4
Thermal Solutions
AMD-K6
Processor Thermal Solution Design
21085I/0—February 1999
Figure 1. Passive Heatsink Thermal Model
Heat Dissipation Path
Figure 2 illustrates the heat dissipation path of the processor.
Due to the lower thermal resistance between the processor die
junction and case, most of the heat generated by the processor
is transferred from the top surface of the case. The small
amount of heat transferred from the bottom side of the
processor can be safely ignored due to high thermal resistance
(the processor socket blocks convection).
Figure 2. Processor Heat Dissipation Path
Figure 3 on page 5 illustrates the overall thermal resistance
model of a socketed AMD-K6 processor with a heatsink
attached. The thermal resistance of the primary heat
dissipation path is much lower than the secondary heat
dissipation path. Therefore, most of the heat is transferred from
the top side of the processor. In Figure 3,
θ
CA
represents the
thermal resistance from the top of the case to ambient. It
includes the thermal resistance of the thermal interface
material and the heatsink, which must be considered when
designing a thermal solution for the AMD-K6 processor.
Temperature Delta
(Case-to-Ambient)
T
CA
Thermal
Resistance
θ
SA
θ
CA
θ
IF
(°C/W)
Case
Sink
Ambient Air
Thin Lid
Case Temperature
Ambient Temperature
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