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參數(shù)資料
| 型號： | 223878119764 |
| 英文描述： | CAPACITOR 1.2UF 16V |
| 中文描述： | 16V的電容1.2UF |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 336K |
| 代理商： | 223878119764 |
2000 May 24
8
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
Class 2, Y5V 16 V, 25 V and 50 V
TESTS AND REQUIREMENTS
Table 2
Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
any applicable method using
×
10 magnification
f = 1 kHz; measuring voltage
1 V
rms
at 25
°
C
f = 1 kHz; measuring voltage
1 V
rms
at 25
°
C
at U
R
(DC) for 1 minute
2.5
×
U
R
for 1 minutes
between minimum and maximum
temperature
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
mounted in accordance with
CECC 32 100, paragraph 4.4
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
preconditioning: 120 to 150
°
C
during 1 minute; 260
±
5
°
C for
10
±
0.5 s in a static solder bath
no visible damage
4.5
visualinspectionand
dimension check
capacitance
in accordance with specification
4.6.1
within specified tolerance
4.6.2
tan
δ
in accordance with specification
4.6.3
4.6.4
4.7.1
insulation resistance
voltage proof
temperature
characteristic
adhesion
R
i
C
R
≥
500 s
no breakdown or flashover
in accordance with specification
4.8
no visible damage
4.9
bond strength of
plating on end face
no visible damage
C/C:
±
30%
4.10
Tb
resistance to
soldering heat
the terminations shall be well
tinned after recovery
C/C:
±
20%
tan
δ
: original specification
R
ins
: original specification
using visual enlargement of
×
10, dissolution of the
terminations shall not
exceed 10%
the terminations shall be well
tinned
resistance to
leaching
260
±
5
°
C for 30
±
1 s
in a static solder bath
4.11
Ta
solderability
zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2
±
0.5 s in a solder
bath at 235
±
5
°
C
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