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| 型號(hào)： | 224-4844-00-3303 |
| 英文描述： | MicroManager Chip |
| 中文描述： | 佐克爾集成電路麻省理工學(xué)院SCHRAUBBETAETIGUNG 24POL |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 47K |
| 代理商： | 224-4844-00-3303 |
3M Electronic Handling and Protection Division
6801 River Place Blvd.
Austin, TX 78726-9000
OEM ZIP DIP Sockets
TS-0360-11
Sheet 1 of 2
Date Issued: November 1, 1999
9.
Physical
Insulation
Material: Glass Filled Polyethermide ( PEI )
Flammability: UL 94V-0
Color: Black
Marking: Raised Letters: Textool/3M Logo & Part Identification
Contact
Material: Beryllium Copper
Plating
Underplate: 75
m " [ 1.91 m m ] Copper – MIL-C-14550
Wiping Area & Solder Tails: 250
m " [ 6.35 m m ] Tin – MIL-T -10727A
Optional Plating
Underplate: 50
m " [ 1.27 m m ] Nickel
Wiping Area & Solder Tails: Gold Flash
Cam
Material: Zinc
Electrical
Current Rating: 1 A
Insulation Resistance: > 1
1012 W at 500 Vdc
Withstanding Voltage: 1000 Vrms at Sea Level
Mechanical
Durability: 100 actuations
Normal Force: 150 grams average per contact
Environmental
Temperature Rating Operating: - 55 °C to +105°C
UL File No.: E68080
BeCu contacts assure continuity with very
short path to P.C. trace
Contact design prevents solder bridging and
wicking
Zero insertion/extraction force achieved with
simple cam rotation using a screwdriver
For use where package field replacement or
re-programming is required for DIP's
Socket contact point of .110" (2.79 mm)
below top surface of socket
Pin counts available from 14 through 64
leads on .100" (2.54 mm) centers
For technical, sales or ordering information call 800-328-0411
or visit our website: http://www.3M.com/ehpd
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