2003 Microchip Technology Inc.
DS21807B-page 21
25XX160A/B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Sales and Support
PART NO.
X
/XX
X
Lead
Package
Tape & Reel
Device
Device
25AA160A
25AA160B
25LC160A
25LC160B
16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM
Tape & Reel
Blank =
T
=
Standard packaging
Tape & Reel
Temperature Range
I
=
E
=
-40
°
C to+85
°
C
-40
°
C to+125
°
C
Package
MS
=
P
=
SN
=
ST
=
Plastic MSOP (Micro Small Outline), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
TSSOP, 8-lead
Lead Finish
Blank
=
G
=
Standard 63% / 37% Sn/Pb
Matte Tin (Pure Sn)
Examples:
a)
25AA160A-I/MS = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package
b)
25AA160B-I/STG = 16 Kbit, 32-byte page, 1.8V
Serial EEPROM, Industrial temp., TSSOP
package, Pb-free
c)
25AA160AT-I/SN = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
d)
25LC160A-I/MSG = 16 Kbit, 16-byte page,
2.5V Serial EEPROM, Industrial temp., MSOP
package, Pb-free
e)
25LC160BT-I/SN = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
f)
25LC160BT-I/ST = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package
–
Finish
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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X
Temp Range