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參數(shù)資料
| 型號： | 25AA256T-IST |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | SENSOR REFLECTIVE OBJECT |
| 中文描述： | 256K SPI總線串行EEPROM |
| 文件頁數(shù)： | 8/26頁 |
| 文件大?。?/td> | 367K |
| 代理商： | 25AA256T-IST |
25AA256/25LC256
DS21822C-page 16
Preliminary
2003 Microchip Technology Inc.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
88
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.360
.373
.385
9.14
9.46
9.78
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
§
eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
α
510
15
5
10
15
Mold Draft Angle Bottom
β
510
15
5
10
15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
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| 24C04AP | IC |
| 25AA256-IMFG | 256K SPI Bus Serial EEPROM |
| 24LC256IP | 256K I 2 C ⑩ CMOS Serial EEPROM |
| 22V10 | DCCE37S |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 25AA256T-ISTG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25AA256XEMF | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25AA256XEP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25AA256XESM | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25AA256XESN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
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