參數(shù)資料
型號: 25AA512
廠商: Microchip Technology Inc.
英文描述: 512 Kbit SPI Bus Serial EEPROM
中文描述: 512千位SPI總線串行EEPROM
文件頁數(shù): 23/32頁
文件大小: 485K
代理商: 25AA512
2007 Microchip Technology Inc.
Preliminary
DS22021B-page 23
25AA512/25LC512
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
§
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
e
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
1.75
0.25
1.25
0.10
0.25
0.40
0.50
1.27
0.17
0.31
0.25
0.51
15°
15°
D
N
e
E
E1
NOTE 1
1
2
3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
Microchip Technology Drawing C04-057B
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