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參數(shù)資料
| 型號： | 25LC256-EMF |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | EEPROM |
| 英文描述： | 256K SPI Bus Serial EEPROM |
| 中文描述： | 256K SPI總線串行EEPROM |
| 文件頁數(shù)： | 18/26頁 |
| 文件大小： | 367K |
| 代理商： | 25LC256-EMF |
25AA256/25LC256
DS21822C-page 18
Preliminary
2003 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
10
5
0
10
5
0
α
Mold Draft Angle Top
0.30
0.25
0.19
.012
.010
.007
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
0.70
0.60
0.50
.028
.024
.020
L
φ
Foot Length
Foot Angle
3.10
3.00
2.90
.122
.118
.114
D
Molded Package Length
4.50
4.40
4.30
.177
.173
.169
E1
Molded Package Width
6.50
6.38
6.25
.256
.251
.246
E
Overall Width
0.15
0.10
0.05
.006
.004
.002
A1
Standoff
§
0.95
0.90
0.85
.037
.035
.033
A2
Molded Package Thickness
1.10
.043
A
Overall Height
0.65
.026
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
0
4
8
0
4
8
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
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相關代理商/技術參數(shù) |
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|---|---|
| 25LC256-EMFG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256EP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-EP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-EPG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256ESM | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
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