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參數(shù)資料
| 型號： | 25LC256-EP |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | EEPROM |
| 英文描述： | 256K SPI Bus Serial EEPROM |
| 中文描述： | 256K SPI總線串行EEPROM |
| 文件頁數(shù)： | 16/26頁 |
| 文件大?。?/td> | 367K |
| 代理商： | 25LC256-EP |
25AA256/25LC256
DS21822C-page 16
Preliminary
2003 Microchip Technology Inc.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES*
NOM
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
8
8
.100
.155
.130
2.54
3.94
3.30
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
§
5
5
5
5
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 25LC256-EPG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256ESM | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256ESN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-ESN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-ESNG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
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