參數(shù)資料
型號: 25LC256T-ISTG
廠商: Microchip Technology Inc.
元件分類: EEPROM
英文描述: 256K SPI Bus Serial EEPROM
中文描述: 256K SPI總線串行EEPROM
文件頁數(shù): 15/26頁
文件大?。?/td> 367K
代理商: 25LC256T-ISTG
2003 Microchip Technology Inc.
Preliminary
DS21822C-page 15
25AA256/25LC256
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
NOM
.050 BSC
INCHES
.194 BSC
.184 BSC
.226 BSC
.236 BSC
.008 REF.
D
D1
D2
Overall Width
Molded Package Width
Exposed Pad Width
JEDEC equivalent: pending
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
Drawing No. C04-113
Lead Width
Lead Length
*Controlling Parameter
Mold Draft Angle Top
Tie Bar Width
R
α
B
L
.014
.020
Dimension Limits
Molded Package Thickness
Standoff
Pitch
Overall Height
Overall Length
Molded Package Length
Exposed Pad Length
Base Thickness
Number of Pins
A3
E
E1
E2
A2
A1
A
.000
Units
n
p
MIN
TOP VIEW
1
2
A2
A
5.99 BSC
5.74 BSC
.019
.030
12
.014
.016
.024
0.35
0.50
.356
0.40
0.60
12
0.47
0.75
MILLIMETERS*
NOM
.039
.031
.002
.026
.0004
.033
0.00
8
MAX
MIN
1.27 BSC
0.20 REF.
4.92 BSC
4.67 BSC
0.85
0.65
0.01
0.80
0.05
1.00
MAX
8
BOTTOM VIEW
n
E
E1
PIN 1
p
B
.085
.091
.097
2.16
2.31
2.46
.152
.158
.163
3.85
4.00
4.15
EXPOSED
METAL
PADS
D2
E2
A1
A3
α
L
ID
D1
D
R
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