參數(shù)資料
型號(hào)： 28-3571-11
廠商： ARIES ELECTRONICS INC
元件分類： 插座
英文描述： DIP28, IC SOCKET
封裝： ROHS COMPLIANT
文件頁(yè)數(shù)： 1/2頁(yè)
文件大?。?/td> 502K
代理商： 28-3571-11
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers
All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers
Swing quick-release handle down to open contacts and insert device. Release and
handle automatically returns as contacts close onto device leads
Socket handle can be mounted on either the right or left side
Sockets can be soldered into PCBs or plugged into any socket
GENERAL SPECIFICATIONS
STANDARD SOCKET BODY: (for -10, -10TL, -11, -16 sockets) black UL 94V-0
glass-filled Polyphenylene Sulfide (PPS)
HIGH-TEMPERATURE SOCKET BODY: (for -18 socket) natural color Poly-
etheretherketone (PEEK)
HANDLE: Stainless Steel
HANDLE KNOB: Brass 360, 1/2-hard (no knob on loop handle)
CONTACT MATERIAL: (for -10, -10TL, -11) BeCu 172 per QQ-C-553; (for -16)
Spinodal; (for -18) BeNi 360, 1/2-hard
ALL BECU CONTACTS: 50μ [1.27μ] min. Ni under plate per QQ-N-290, over plated with either: -10 200μ [5.08μ] min. matte
Sn per ASTM B545-97; or -10TL 200μ [5.08μ] min. 90/10 Sn/Pb per MIL-T-10727-11 10μ [0.25μ] min. Au per MIL-G-45204
SPINODAL CONTACT PLATING: (for -16) 50μ [1.27μ] min. NiB
HIGH-TEMPERATURE BeNi CONTACT PLATING:
(for -18) 50μ [1.27μ] NiB
CONTACT CURRENT RATING: 1 amp
INSULATION RESISTANCE: 1000 mΩ min.
DIELECTRIC WITHSTANDING VOLTAGE: 1000
VAC
LIFE CYCLE: 25,000 to 50,000 cycles
OPERATING TEMPERATURE: min. -67°F
[-55°C]; max. 221°F [105°C] for
Sn plating, 302°F [150°C] for Au plating, 392°F
[200°C] for NiB plating,
482°F [250°C] for high-temperature socket
RETENTION FORCE (closed): 55 grams/pin
based on a 0.020 [0.51] dia. test lead
ACCEPTS LEADS: 0.015-0.035 [0.38-0.89]
wide, 0.110-0.280 [2.79-7.11] long
MOUNTING CONSIDERATIONS
See socket footprint below
10019
1 of 2
Rev. AA
Series X57X Quick-Release Universal
Zero-Insertion-Force DIP Test Socket
Handle
Dim “H1”
Dim. “H2”
Dim “H3”
Long w/Knob
0.568 [14.43]
0.300 [7.62]
0.471 [11.96]
Short w/ Knob
0.317 [8.05]
0.400 [10.16]
0.252 [6.40]
Loop (no Knob) 0.270 [6.86]
0.193 [4.90]
0.405 [10.29]
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE: Aries reserves the
right to change product general specifications without notice.
Pins
24, 28, 32, 36,
40, 42, 44, 48
Row-to-Row Spacing (btm)
3 = 0.300 [7.62]
6 = 0.600 [15.24] (std)
ORDERING INFORMATION
XX-X57X-1 8
Plating
0 = Sn over Ni
OTL = Sn/Pb over Ni
1 = Ay over Ni
6 = NiB (Spinodal)
8 = Hi-temp Socket*
Solder Pin Tail
45° Handle Options
0 = Long Handle, right side
1 = Long Handle, left side
2 = Short Handle, right side
3 = Short Handle, left side
4 = Loop Handle, right side
5 = Loop Handle, left side
* NOTE: only Loop Handle available
w/hi-temp. socket
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
28-3571-16 功能描述:IC 與器件插座 QUICK RELEASE 28 PIN NICKEL RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
28-3571-18 制造商:ARIES 制造商全稱:Aries Electronics, Inc. 功能描述:Quick-Release Universal Zero-Insertion-Force DIP Test Socket
28-3572-10 功能描述:IC 與器件插座 QUICK RELEASE 28 PIN TIN RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
28-3572-11 功能描述:IC 與器件插座 QUICK RELEASE 28 PIN GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
28-3572-16 功能描述:IC 與器件插座 QUICK RELEASE 28 PIN NICKEL RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
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