- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360790 > 2902-5006-62 OSMP Microminiature Push-On Coaxial Connectors PDF資料下載
參數(shù)資料
| 型號(hào)： | 2902-5006-62 |
| 英文描述： | OSMP Microminiature Push-On Coaxial Connectors |
| 中文描述： | OSMP超小型推進(jìn)式同軸連接器 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 175K |
| 代理商： | 2902-5006-62 |
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
I
Asia/Pacific: Tel. +81 3 3263 8761
Fax +81 3 3263 8769
I
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020
7
Specifications Subject to Change Without Notice.
OSMP
Application Notes
OSMP connectors are designed with maximum packaging density in mind. Their low profile construction allows for module to mod-
ule flush mounting with a center to center spacing of .170 inches. Connectors are user friendly with simple self contained designs
which equates to low installation costs and reduced fabrication time for cable assemblies and circuit packages.
Cable connectors are designed for miniature .047 and .085 semi rigid cables to support density packaging solutions with reduced
cross talk of transmission lines and low EMI characteristics. Standard connector configurations are right angle and straight female
interface designs, (Fig 1). The right angle connector design requires solder attachment of the cable jacket to connector housing only.
Internal assembly is self aligning with a solderless right angle contact junction which facilitates assembly.
Circuit packages will employ bulkhead press-in or solder-in shrouds or if space permits a 2 hole flange mount shroud is available (Fig 2).
The shrouds are the coupling mechanism to engage mating connections. The shrouds are used with a glass bead sub-assembly to
form the entire coaxial mating interface structure. The glass bead is the internal conductor and the shroud will be the outer conductor.
Solder-in shrouds with internal glass beads are available to eliminate the two stage assembly required for separate bead and shroud
combination.
The OSMP push-on interface with smooth bore detent shrouds allows the packaging engineer to mate multiple connectors simultane-
ously. Modular designed systems can also be constructed using the blindmate concept with full detent and limited detent shrouds
where positive locking is required. A full detent shroud offers maximum locking engagement for stationary input interfaces. A limited
detent with reduced engagement forces can be utilized for internal modular construction where multiple mates may occur. The basic
design of this microminiature series provides for a variety of interface configurations that can be a versatile and reliable design solution.
Figure 1
Figure 2
Figure 3
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 2902-7947-62 | 5-Pin, Multiple-Input, Programmable Reset ICs |
| 2902-7985-62 | OSMP Microminiature Push-On Coaxial Connectors |
| 2980-2240-00 | OSMP Microminiature Push-On Coaxial Connectors |
| 2980-5004-62 | 5-Pin, Multiple-Input, Programmable Reset ICs |
| 2981-2241-00 | OSMP Microminiature Push-On Coaxial Connectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 290-255 | 功能描述:厚膜電阻器 - SMD 255ohms 1% Tol RoHS:否 制造商:Bourns 電阻:1.5 Ohms 容差:1 % 功率額定值:25 W 電壓額定值:250 V 外殼代碼 - in: 外殼代碼 - mm: 端接類型:SMD/SMT 溫度系數(shù):100 PPM / C 系列:PWR163 工作溫度范圍:- 55 C to + 155 C 封裝:Tube |
| 290-255K | 功能描述:厚膜電阻器 - SMD USE 290-255K-RC RoHS:否 制造商:Bourns 電阻:1.5 Ohms 容差:1 % 功率額定值:25 W 電壓額定值:250 V 外殼代碼 - in: 外殼代碼 - mm: 端接類型:SMD/SMT 溫度系數(shù):100 PPM / C 系列:PWR163 工作溫度范圍:- 55 C to + 155 C 封裝:Tube |
| 290-255K-RC | 功能描述:厚膜電阻器 - SMD 1/8WATT 255KOHMS RoHS:否 制造商:Bourns 電阻:1.5 Ohms 容差:1 % 功率額定值:25 W 電壓額定值:250 V 外殼代碼 - in: 外殼代碼 - mm: 端接類型:SMD/SMT 溫度系數(shù):100 PPM / C 系列:PWR163 工作溫度范圍:- 55 C to + 155 C 封裝:Tube |
| 290-255-RC | 功能描述:厚膜電阻器 - SMD 1/8WATT 255OHMS RoHS:否 制造商:Bourns 電阻:1.5 Ohms 容差:1 % 功率額定值:25 W 電壓額定值:250 V 外殼代碼 - in: 外殼代碼 - mm: 端接類型:SMD/SMT 溫度系數(shù):100 PPM / C 系列:PWR163 工作溫度范圍:- 55 C to + 155 C 封裝:Tube |
| 2902580 | 制造商:Phoenix Contact 功能描述:DCT POWER DEMO PANEL |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。