Electrical Characteristics for Fixed 5V Version
(Continued)
V
IN
= 14V, I
O
= 10mA, T
J
= 25C, C2 = 100 μF (unless otherwise specified) (Note 2)
Parameter
Conditions
LM2931A-5.0
LM2931-5.0
Units
Typ
Limit
(Note 3)
50
Typ
Limit
(Note 3)
50
Load Regulation
Output Impedance
5 mA
≤
I
O
≤
100mA
100mA
DC
and 10mA
rms
,
100Hz -10kHz
I
O
≤
10mA, 6V
≤
V
IN
≤
26V
40C
≤
T
J
≤
125C
I
O
= 100mA, V
IN
= 14V, T
J
= 25C
14
200
14
200
mV
MAX
m
Quiescent Current
0.4
1.0
0.4
1.0
mA
MAX
15
30
5
15
mA
MAX
mA
MIN
μV
rms
mV/1000
hr
dB
MIN
Output Noise Voltage
Long Term Stability
10Hz -100kHz, C
OUT
= 100μF
500
20
500
20
Ripple Rejection
Dropout Voltage
f
O
= 120 Hz
I
O
= 10mA
I
O
= 100mA
80
0.05
0.3
33
55
0.2
0.6
26
80
0.05
0.3
33
0.2
0.6
26
V
MAX
Maximum Operational Input
Voltage
Maximum Line Transient
V
MIN
R
L
= 500
, V
O
≤
5.5V,
T = 1ms,
τ ≤
100ms
V
O
≥
0.3V, R
L
= 500
70
60
70
50
V
MIN
Reverse Polarity Input
Voltage, DC
Reverse Polarity Input
Voltage, Transient
30
15
30
15
V
MIN
T = 1ms,
τ ≤
100ms, R
L
= 500
80
50
80
50
V
MIN
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2:
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3:
All limits are guaranteed for T
J
= 25C (standard type face) or over the full operating junction temperature range of 40C to +125C (bold type face).
Note 4:
The maximum power dissipation is a function of maximum junction temperature T
Jmax
, total thermal resistance
θ
JA
, and ambient temperature T
A
. The
maximum allowable power dissipation at any ambient temperature is P
D
= (T
Jmax
T
A
)/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150C
and the LM2931 will go into thermal shutdown. For the LM2931 in the TO-92 package,
θ
JA
is 195C/W; in the SO-8 package,
θ
JA
is 160C/W, and in the TO-220
package,
θ
JA
is 50C/W; in the TO-263 package,
θ
JA
is 73C/W; and in the 6-Bump micro SMD package
θ
JA
is 290C/W. If the TO-220 package is used with a heat
sink,
θ
JA
is the sum of the package thermal resistance junction-to-case of 3C/W and the thermal resistance added by the heat sink and thermal interface.
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5
square inches of copper area,
θ
JA
is 50C/W; with 1 square inch of copper area,
θ
JA
is 37C/W; and with 1.6 or more square inches of copper area,
θ
JA
is 32C/W.
Note 5:
Human body model, 100 pF discharged through 1.5 k
.
Electrical Characteristics for Adjustable Version
V
IN
= 14V, V
OUT
= 3V, I
O
= 10 mA, T
J
= 25C, R1 = 27k, C2 = 100 μF (unless otherwise specified) (Note 2)
Parameter
Conditions
Typ
Limit
Units
Limit
V
MAX
V
MIN
V
MAX
V
MIN
V
MAX
V
MIN
mV/V
MAX
%
MAX
m
/V
mA
MAX
mA
mA
MAX
Reference Voltage
1.20
1.26
1.14
1.32
1.08
24
3
1.5
1
I
O
≤
100 mA, 40C
≤
T
j
≤
125C, R1 = 27k
Measured from V
OUT
to Adjust Pin
Output Voltage Range
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
V
OUT
+ 0.6V
≤
V
IN
≤
26V
5 mA
≤
I
O
≤
100 mA
100 mA
DC
and 10 mA
rms
, 100 Hz–10 kHz
I
O
= 10 mA
I
O
= 100 mA
During Shutdown R
L
= 500
0.2
0.3
40
0.4
15
0.8
1
1
L
www.national.com
6