參數(shù)資料
型號： 298D476X02R5M2T
廠商： Vishay Intertechnology,Inc.
英文描述： Solid Tantalum Chip Capacitors MICROTAN⑩ Lead Frameless Molded
中文描述： 固體鉭芯片電容器MICROTAN⑩鉛無框模壓
文件頁數(shù)： 4/7頁
文件大小： 162K
代理商： 298D476X02R5M2T
www.vishay.com
41
For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 22-Oct-07
298D
Solid Tantalum Chip Capacitors
M
ICRO
T
AN
TM
Lead Frameless Molded
Vishay Sprague
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3
Ω
series resistance,
MIL-STD 202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD 202G Method 103B
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Thermal Shock
At - 55 °C/+ 125 °C, 30 min. each,
for 5 cycles. MIL-STD 202G Method 107G
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 ± 1 s
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Substrate Bending
(Board flex)
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Vibration
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
Mil-Std-202G, Method 213B, Condition I,
100G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to Solder
Heat
At 260 °C, for 10 seconds, reflow
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to Solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solvents
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL94 VO with an
oxygen index of 32 %.
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