H04-004-03a
MS5F6136
13
5
L
Vcc
Ic
V
CE
R
G
V
GE
V
GE
V
CE
Ic
0V
0A
0V
10%
90%
10%
10%
90%
90%
0V
Ic
V
CE
~
~
~
~
~
~
o n
t
r
t
r(i )
t
of f
t
f
t
r r
I
r r
t
5. Thermal resistance characteristics
(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.
6. Indication on module
Logo of production
Lot.No.
Place of manufacturing (code)
7.Applicable category
This specification is applied to IGBT Module named 2MBI200U4H-170 .
8.Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% .
Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
Avoid exposure to corrosive gases and dust.
Avoid excessive external force on the module.
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
°C/W
2MBI200U4H-170
Contact Thermal resistance
(1device) (*5)
Rth(c-f)
with Thermal Compound
Thermal resistance(1device)
Rth(j-c)
-
-
-
200A 1700V
Items
Symbols
Conditions
Characteristics
min.
typ.
Units
max.
0.12
0.20
IGBT
FWD
0.025
-
-
-