參數(shù)資料
型號(hào)： 2N6288AS
廠商： ON SEMICONDUCTOR
元件分類： 功率晶體管
英文描述： 7 A, 30 V, NPN, Si, POWER TRANSISTOR
封裝： TO-220AB, 3 PIN
文件頁(yè)數(shù)： 11/60頁(yè)
文件大小： 371K
代理商： 2N6288AS
4–3
Surface Mount Package Information and Tape and Reel Specifications
Motorola Bipolar Power Transistor Device Data
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. This is not the case with the
DPAK and D2PAK packages. If a 1:1 opening is used to
screen solder onto the drain pad, misalignment and/or “tomb-
stoning” may occur due to an excess of solder. For these two
packages, the opening in the stencil for the paste should be
approximately 50% of the tab area. The opening for the leads
is still a 1:1 registration. Figure 3 shows a typical stencil for
the DPAK and D2PAK packages. The pattern of the opening
in the stencil for the drain pad is not critical as long as it
allows approximately 50% of the pad to be covered with
paste.
Figure 3. Typical Stencil for DPAK and
D2PAK Packages
SOLDER PASTE
OPENINGS
STENCIL
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to mini-
mize the thermal stress to which the devices are subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100
°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10
°C.
The soldering temperature and time should not exceed
260
°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5
°C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.
相關(guān)PDF資料
PDF描述
2N6288 7 A, 30 V, NPN, Si, POWER TRANSISTOR, TO-220
2N6124 4 A, 45 V, PNP, Si, POWER TRANSISTOR, TO-220
2N6293 7 A, 70 V, NPN, Si, POWER TRANSISTOR, TO-220
2N6473 4 A, 100 V, NPN, Si, POWER TRANSISTOR, TO-220
2SB435 3 A, 40 V, PNP, Si, POWER TRANSISTOR, TO-220
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
2N6288G 功能描述:兩極晶體管 - BJT 7A 30V 40W NPN RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
2N6289 制造商:NJSEMI 制造商全稱:New Jersey Semi-Conductor Products, Inc. 功能描述:MAXIMUM RATINGS, ABSOLUTE-MAXIMUM VALUOS
2N629 制造商:NJSEMI 制造商全稱:New Jersey Semi-Conductor Products, Inc. 功能描述:GE PNP POWER BJT
2N6290 功能描述:兩極晶體管 - BJT NPN Power SW RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
2N6290 制造商:SPC Multicomp 功能描述:TRANSISTOR NPN TO-220
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