參數(shù)資料
型號: 33661
廠商: Motorola, Inc.
英文描述: LIN Enhanced Physical Interface
中文描述: 林增強型物理接口
文件頁數(shù): 1/20頁
文件大?。?/td> 377K
代理商: 33661
RXD
33661
MCU
TXD
EN
WAKE
LIN
GND
INH
V
SUP
LIN Bus
V
PWR
12.0 V / 5.0 V
Regulator
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
Motorola, Inc. 2004
Document order number: MC33661
Rev 3.0, 10/2004
33661
Advance Information
LIN Enhanced Physical Interface
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller Area
Network (CAN). As the lowest level of a hierarchical network, LIN enables
cost-effective communication with sensors and actuators when all the features
of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN sub-
bus applications. It offers slew rate selection for optimized operation at
10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and
programming modes
,
excellent radiated emission performance, and safe
behavior in the event of LIN bus short-to-ground or LIN bus leakage during
low-power mode.
Features
Operational from V
SUP
6.0 V to 18 V DC, Functional up to 27 V DC, and
Handles 40 V During Load Dump
Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
5.0 kV ESD on LIN Bus Terminal
30 k
Internal Pullup Resistor
LIN Bus Short-to-Ground or High Leakage in Sleep Mode
-18 V to +40 V DC Voltage at LIN Terminal
8.0
μ
A Standby Current in Sleep Mode
Local and Remote Wake-Up Capability Reported by INH and RXD
Terminals
5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
LIN INTERFACE
ORDERING INFORMATION
Device
Temperature
Range (T
A
)
Package
MC33661D/R2
-40°C to 125°C
8 SOICN
D SUFFIX
CASE 751-06
8-TERMINAL SOICN
33661 Simplified Application Diagram
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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