參數(shù)資料
型號： 33702
廠商： Motorola, Inc.
英文描述： 3.0 A Switch-Mode Power Supply with Linear Regulator
中文描述： 3.0開關(guān)模式電源，線性穩(wěn)壓器
文件頁數(shù)： 5/24頁
文件大小： 841K
代理商： 33702
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33702
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Supply Voltage
V
IN1
, V
IN2
-0.3 to 7.0
V
Switching Node
SW
-1.0 to 7.0
V
Buck Regulator Bootstrap Input (BOOT - SW)
BOOT
-0.3 to 8.5
V
Boost Regulator Output
V
BST
-0.3 to 8.5
V
Boost Regulator Drain
V
BD
-0.3 to 9.5
V
RESET
Drain Voltage
RESET
-0.3 to 7.0
V
Enable Pins (EN1, EN2)
–
-0.3 to 7.0
V
Logic Pins (SDA, SCL, CLKSYN)
–
-0.3 to 7.0
V
Analog Pins (INV, V
OUT
,
RESET
)
–
-0.3 to 7.0
V
Analog Pins (LDRV
,
LFB, LDO, LCMP, CS)
–
-0.3 to 8.5
V
Analog Pins (CLKSEL, ADDR, RT, FREQ, V
DDI
)
–
-0.3 to 3.6
V
ESD Voltage
Human Body Model
(Note 1)
Machine Model
(Note 2)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-65 to 150
°
C
Power Dissipation (T
A
= 85°C)
(Note 3)
P
D
TBD
W
Lead Soldering Temperature
(Note 4)
T
SOLDER
260
°
C
Maximum Junction Temperature
T
JMAX
125
°
C
Thermal Resistance, Junction to Ambient
(Note 5)
R
θ
JA
68
°
C/W
Thermal Resistance, Junction to Base
(Note 6)
R
θ
JB
18
°
C/W
OPERATING CONDITIONS
Supply Voltage (V
IN1
, V
IN2
)
V
IN1
, V
IN2
2.8 to 6.0
V
Operational Package Temperature (Ambient Temperature)
T
A
-40 to 85
°C
Notes
1.
2.
3.
4.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
).
Maximum power dissipation at indicated junction temperature.
Lead soldering temperature limit is for 10 seconds maximum duration. Contact Motorola Sales Office for device immersion soldering time/
temperature limits.
Thermal resistance measured in accordance with EIA/JESD51-2.
Theoretical thermal resistance from the die junction to the exposed pins.
5.
6.
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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