參數(shù)資料
型號: μPD78P058FY
廠商: NEC Corp.
元件分類: 8位微控制器
英文描述: 8 Bit Single Chip Microcontrollers
中文描述: 8位單片機(jī)微控制器
文件頁數(shù): 10/74頁
文件大小: 520K
代理商: ΜPD78P058FY
10
μ
PD78P058FY
CONTENTS
1.
DIFFERENCES BETWEEN
μ
PD78P058FY AND MASK ROM VERSIONS...................................11
2.
PIN FUNCTIONS ................................................................................................................................12
2.1
Pins in Normal Operating Mode............................................................................................................ 12
2.2
Pins in PROM Programming Mode....................................................................................................... 16
2.3
Pin Input/Output Circuits and Recommended Connection of Unused Pins .................................. 17
3.
MEMORY SIZE SWITCHING REGISTER (IMS)...............................................................................21
4.
INTERNAL EXPANSION RAM SIZE SWITCHING REGISTER (IXS).............................................22
5.
PROM PROGRAMMING....................................................................................................................23
5.1
Operating Modes..................................................................................................................................... 23
5.2
PROM Write Procedure .......................................................................................................................... 25
5.3
PROM Read Procedure .......................................................................................................................... 29
6.
SCREENING OF ONE-TIME PROM VERSIONS .............................................................................30
7.
ELECTRICAL SPECIFICATIONS .....................................................................................................31
8.
PACKAGE DRAWINGS.....................................................................................................................62
9.
RECOMMENDED SOLDERING CONDITIONS ................................................................................64
APPENDIX A. DEVELOPMENT TOOLS.................................................................................................65
APPENDIX B. RELATED DOCUMENTS ................................................................................................69
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