7741 North Business Park Drive
7741 North Business Park Drive
T
Tucson,
ucson,
ucson, Arizona 85743
Arizona 85743
Ph: 520-744-0400 Fax: 520-744-6155
W
Website: www
ebsite: www
ebsite: www.tusonix.com E-mail: sales@tusonix.com
.tusonix.com E-mail: sales@tusonix.com
Revision 5, Updated 03-26-03
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+1 4 +71 6
4702 =
+1 4 +71 6
4700/ 4701 =
EMI/RFI Surface Mount
πππππ & C Filters for SMT Applications
& C Filters for SMT Applications
Soldering Notes:
Surface Mount
πππππ & C Filters may be soldered to Printed
Circuit Boards and substrates in a variety of methods:
solder wave, hot air, oven soldering, vapor phase
reflow, infrared soldering or immersion soldering.
Ceramic Components require careful soldering tech-
niques to avoid the possible effects of thermal shock.
These effects can be minimized by using a preheat
process prior to soldering. Both time and temperature
are important in the preheat cycle.
When using soldering irons, it is very important that
the solder iron tip does not touch the ceramic body.
The iron should be applied only to the termination sol-
der fillet. The temperature of the soldering tip should
be controlled to 500°F (260°C) max. Soldering should
be achievable in 2-3 seconds. Recommended solder
composition is 60% tin and 40% lead.
Failure to follow proper preheat and solder practices
can result in thermal shock to the ceramic body which
may be manifested as:
Micro cracks in the ceramic body
Electrical shorts
Insulation resistance degradation in
accelerated life test conditions.
All Surface Mount
πππππ & C Filters have nickel barrier,
solder plated electrodes and are ideally suited for
manufacturers who use various soldering techniques
on a multitude of products.
However, the amount of
solder must be controlled to allow for adequate trans-
fer of heat and mechanical stresses from the PCB to
the Filter.
Handling:
Extreme care should be exercised when handling ce-
ramic components. They should be treated as fragile
components. Excessive force or direct impact to the
dielectric may result in chips, cracks or breakage.
Cleaning:
Components should be cleaned immediately follow-
ing the soldering operation to optimize flux removal
conditions. Cleaning solutions should be kept clean
to avoid contaminating the components. The user
should consult the manufacturer’s Material Safety Data
Sheets for specific handling details.
Excessive temperature differences or excessive agi-
tation during cleaning may damage the filters.
Product Installation Recommendations
for Surface Mount
πππππ & C Filters
& C Filters
Dielectric Withstanding - 300VDC
Direct Current Rating - 10 ADC
Inductance Value - 100nH Minimum
Please note:
Please note: Additional
Capacitance Values and
Mounting Patterns are
available upon request.
TUSONIX
Part
Number
W
Working
orking
V
Volts DC
olts DC
85°C
125°C
4700-006
4700-009
4700-005
4700-003
4700-008
4701-002
4701-001
4702-000
4702-001
4702-002
4702-003
4702-004
4702-005
T
Typical No-Load Insertion Loss
ypical No-Load Insertion Loss
(dB) at 25°C per MIL-Std-220
100MHz
10MHz
1GHz
Cap.
(pF)
Capacitance
T
Tolerance
olerance
SQUARE FIL
SQUARE FILTERS
TERS
+80%/-20%
GMV
+80%/-20%
100
--
100
--
100
470
1000
2000
4000
6800
8200
100
470
1000
1500
2500
4000
3
16
40
45
52
60
65
1
12
20
22
25
30
16
40
65
70
19
27
35
37
40
45
--
1
7
10
13
16
20
--
3
5
10
15
100
TUSONIX
Part
Number
W
Working
orking
V
Volts DC
olts DC
85°C
85°C 125°C
125°C
4700-059
4700-058
4700-053
4700-056
T
Typical No-Load Insertion Loss
ypical No-Load Insertion Loss
(dB) at 25°C per MIL-Std-220
100MHz
10MHz
1GHz
Cap.
(pF)
Capacitance
T
Tolerance
olerance
ROUND FIL
ROUND FILTERS
TERS
+80%/-20%
GMV
+80%/-20%
100
--
100
1000
2000
5000
--
7
10
15
3
40
45
55
16
65
70
Denotes “C” type filters - 20 Adc