參數(shù)資料
型號(hào): 48242-0001
廠商: MOLEX INC
元件分類(lèi): 電信和以太網(wǎng)連接器
英文描述: Mini-B Rec Conn SMT Sink L/F
中文描述: 5 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SURFACE MOUNT, JACK
文件頁(yè)數(shù): 1/2頁(yè)
文件大?。?/td> 89K
代理商: 48242-0001
FEATURES AND SPECIFICATIONS
SPECIIFICATIONS
Universal Serial Bus (USB)
On-The-Go (OTG)
48242
Mini-B Receptacle
SMT, Right Angle
Sink Type
Molex offers the USB On-The-Go Mini-B Receptacle Sink Type for mobile
devices.
Data exchange between handheld mobile devices are becoming very popular
due to it’s portability. Considerations for data transfer, integrity and
synchronization without having to go through a PC host give rise to the
development of the USB On-The-Go (OTG).
The development of the Mini-B fills the gap in our USB product for handheld
applications. It is fully compliant with the USB 2.0 specs that enables data
transfer speeds of up to 480Mbs, The physical structure is different from the
standard USB ‘B’ connector in terms of the shape of the shell, circuit size i.e.
5 circuits (one reserved for host identification) vs 4 circuits and physical size
(1/8 of the standard ‘B’).
Features
Benefits
Metal shielding on all sides
Superior shielding against RFI and EMI
Single piece design
Easy assembly
Grounding fingers
Ground mating halves
Solder tab
Secure PCB retention
Small footprint
Less PCB real estate
Detent lock
Strong plug retention
Shell design
Prevents mismating
ID pin
Supports bi-directional data transmission
between devices
Reference Information
Packaging: Embossed Tape on Reel
UL File No.:
CSA File No.:
Mates With: USB OTG mini-B Plug
Designed In: mm
Electrical
Voltage: 100V DC
Current: 1.8A
Contact Resistance: 40 milliohms Max
Dielectric Withstanding Voltage: 100V AC
Insulation Resistance: 100 Megohms min.
Mechanical
Cable pull out Force: 40.00N (8.99lb)
Contact Retention Force min: 4.00N (0.90lb)
Mating Force: 35.00N (7.87lb)
Unmating Force: 10.00N (2.25lb)
Durability: 5000 cycles
Physical
Housing: Liquid Crystal Polymer,
Glass-filled, UL 94V-0
Contact: Phosphor Bronze (CuSn)
Plating:
Contact Area — 0.76μm (30 μ”) Gold (Au)
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
Operating Temperature: -20°C to +85°C
相關(guān)PDF資料
PDF描述
482X
483-10-216-00-001 PCB Header Strips Single row / double row Wire-wrap / solder tail
48307-7022
485003-1 0.9 mm2, STEEL, NICKEL FINISH, RING TERMINAL
485015-1 15 mm2, BRASS, TIN FINISH, RING TERMINAL
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