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參數(shù)資料
| 型號： | 4880G |
| 廠商： | Aavid Thermalloy |
| 文件頁數(shù)： | 106/116頁 |
| 文件大小： | 0K |
| 描述： | MOUNTING KIT TO-220 |
| 標準包裝： | 1,000 |
| 系列： | 4880 |
| 附件類型： | 安裝套件 |
| 適用于相關(guān)產(chǎn)品： | 散熱片 |
| 產(chǎn)品目錄頁面： | 2672 (CN2011-ZH PDF) |
| 配用： | HS410-ND - BOARD LEVEL HEATSINK 1.95" TO220 HS404-ND - BOARD LEVEL HEATSINK 1" TO-220 HS415-ND - BOARD LEVEL HEATSINK .375"TO-220 HS388-ND - HEATSINK TO-220 2.5W BLK W/PINS HS387-ND - HEATSINK TO-220 PWR BLK W/PINS HS386-ND - HEATSINK TO-220 H=2.5" BLK W/PIN HS382-ND - HEATSINK TO-220 POWER W/PINS BK HS380-ND - HEATSINK TO-220 POWER W/PINS BK HS374-ND - HEATSINK TO-220 W/PINS BLK 2" HS373-ND - HEATSINK TO-220 VERT MNT W/TABS 更多... |
| 其它名稱： | 034794 4880G-ND HS417 |
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9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 4880M | 制造商:Aavid Thermalloy 功能描述:Mounting Kits Mica Insulator |
| 4880MG | 功能描述:導(dǎo)熱接口產(chǎn)品 MOUNTING KIT TO-220 RoHS:否 制造商:Panasonic Electronic Components 類型:Thermal Graphite Sheets 材料:Graphite Polymer Film 長度:180 mm 寬度:115 mm 厚度:0.07 mm 工作溫度范圍: |
| 4880S | 功能描述:散熱片 MOUNTING KIT TO-220 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計目的:Express-HRR |
| 4880SG | 功能描述:散熱片 MOUNTING KIT TO-220 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計目的:Express-HRR |
| 4881 | 制造商:FILTRAN 制造商全稱:Filtran LTD 功能描述:Power Transformers Low Profile |
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