參數(shù)資料
型號： 4953G
廠商： Aavid Thermalloy
文件頁數(shù)： 34/116頁
文件大?。?/td> 0K
描述： THERMAL EPOXY
MSDS 材料安全數(shù)據(jù)表： 4953A THERMALBOND MSDS
4953B THERMALBONDMSDS
標準包裝： 1
系列： Thermalbond™
類型： 環(huán)氧樹脂硬化劑
尺寸/尺寸： 4 磅包裝
其它名稱： 033871
24
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.3
(0.05)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
25
0
20
40
60
80
100
0.0
0.5
1.0
1.5
2.0
2.5
20
15
5
10
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
ORDERING INFORMATION
1.3
(0.05)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.37
(0.290)
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
7106
Surface mount heat sink for D
2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 25 for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Refer to Figure C on page 26 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
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相關代理商/技術參數(shù)
參數(shù)描述
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4-954293-1 制造商:TE Connectivity 功能描述:
49544-0892 制造商:MOLEX 功能描述:
49545-0892 功能描述:集管和線殼 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
49-54-5615 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT
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