參數(shù)資料
型號: 4N55#300
元件分類: 光電耦合器
英文描述: 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
封裝: GULL WING, HERMETIC, DIP-16
文件頁數(shù): 6/13頁
文件大?。?/td> 299K
代理商: 4N55#300
Truth Table
(Positive Logic)
Functional Diagram
Multiple Channel Devices Available
Input
Output
On (H)
L
Off (L)
H
V CC
GND
V O
V B
EachchannelcontainsaGaAsPlightemittingdiodewhich
is optically coupled to an integrated photon detector.
Separate connections for the photodiodes and output
transistor collectors improve the speed up to a hundred
times that of a conventional phototransistor optocoupler
by reducing the base-collector capacitance.
These devices are suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF
= 16 mA. The 18 V VCC capability will enable the designer
to interface any TTL family to CMOS. The availability of
the base lead allows optimized gain/ bandwidth adjust-
ment in analog applications. The shallow depth of the
IC photodiode provides better radiation immunity than
conventional phototransistor couplers.
These products are also available with the transistor base
node not connected to improve common mode noise
immunity and ESD susceptibility. In addition, higher CTR
minimums are available by special request.
Packagestylesforthesepartsare8and16pinDIPthrough
hole (case outlines P and E respectively), 16 pin DIP flat
pack (case outline F), and leadless ceramic chip carrier
(case outline 2). Devices may be purchased with a variety
ofleadbendandplatingoptions,seeSelectionGuideTable
for details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same functional die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operatingconditions,electricalspecifications,andperfor-
mance characteristics shown in the figures are identical
for all parts. Occasional exceptions exist due to package
variations and limitations and are as noted. Additionally,
the same package assembly processes and materials are
used in all devices. These similarities give justification for
the use of data obtained from one part to represent other
part’s performance for die related reliability and certain
limited radiation test results.
相關(guān)PDF資料
PDF描述
4N55/883B#300 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
4N55 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
4N55#100 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
4N55#200 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
4N55/883B#200 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps
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