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參數(shù)資料
| 型號(hào)： | 4N55/883B#200 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類(lèi)： | 光電耦合器 |
| 英文描述： | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
| 封裝： | HERMETIC SEALED, DIP-16 |
| 文件頁(yè)數(shù)： | 5/12頁(yè) |
| 文件大?。?/td> | 276K |
| 代理商： | 4N55/883B#200 |
2
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Lead Style
Through Hole
Unformed Leads
Surface Mount
Channels
2
1
2
4
2
Common Channel Wiring
None
VCC GND
None
Agilent Part # & Options
Commercial
4N55*
HCPL-5500
HCPL-5530
HCPL-6550
HCPL-6530
MIL-PRF-38534, Class H
4N55/883B
HCPL-5501
HCPL-5531
HCPL-6551
HCPL-6531
MIL-PRF-38534, Class K
HCPL-257K
HCPL-550K
HCPL-553K
HCPL-655K
HCPL-653K
Standard Lead Finish
Gold Plate
Solder Pads
Solder Dipped
Option #200
Butt Cut/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
Class H SMD Part #
Prescript for all below
5962-
Either Gold or Solder
8767901EX
9085401HPX
8767902PX
8767904FX
87679032X
Gold Plate
8767901EC
9085401HPC
8767902PC
8767904FC
Solder Dipped
8767901EA
9085401HPA
8767902PA
87679032A
Butt Cut/Gold Plate
8767901UC
9085401HYC
8767902YC
Butt Cut/Soldered
8767901UA
9085401HYA
8767902YA
Gull Wing/Soldered
8767901TA
9085401HXA
8767902XA
Prescript for all below
5962-
Either Gold or Solder
8767905KEX
9085401KPX
8767906KPX
8767908KFX
8767907K2X
Gold Plate
8767905KEC
9085401KPC
8767906KPC
8767908KFC
Solder Dipped
8767905KEA
9085401KPA
8767906KPA
8767907K2A
Butt Cut/Gold Plate
8767905KUC
9085401KYC
8767906KYC
Butt Cut/Soldered
8767905KUA
9085401KYA
8767906KYA
Gull Wing/Soldered
8767905KTA
9085401KXA
8767906KXA
*JEDEC registered part.
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PDF描述 |
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| 4N55#300 | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
| 4N55/883B#100 | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
| 4N55/883B | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
| 4N55/883B | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
| 4N55 | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4 Mbps |
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