參數(shù)資料
型號: 501503B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 36/116頁
文件大小: 0K
描述: HEATSINK TO-3 1.00" BLK
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 501503B Series
標(biāo)準包裝: 1,000
類型: 插件板級
冷卻式包裝: TO-3
固定方法: 把緊螺栓
形狀: 菱形
長度: 1.88"(47.75mm)
寬: 1.400"(35.56mm)
機座外的高度(散熱片高度): 1.000"(25.40mm)
溫升時的功耗: 5W @ 40°C
在強制氣流下的熱敏電阻: 在 500 LFM 時為2.0°C/W
自然環(huán)境下的熱電阻: 8.4°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
其它名稱: 501503B00000
6015B
HS248
26
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
FIGURE A
SMT Footprints
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
7.62
(0.300)
15.49
(0.610)
1.40
(0.060)
0.80
(0.030)
W
L
1
2
FIGURE B
FIGURE D
FIGURE C
L
W
16.76
(0.660)
2.54
(0.100)
10.67
(0.420)
20.32
(0.800)
2.54
(0.100)
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
Part Number
“L”
“W”
573100
9.53 (0.375)
13.97 (0.550)
573300
14.22 (0.560)
16.26 (0.640)
573400
14.22 (0.560)
21.08 (0.830)
Part Number
“L”
“W1”
“W2”
573100
9.02 (0.355)
13.46 (0.530)
8.89 (0.350)
573300
13.72 (0.540)
15.75 (0.620)
11.18 (0.440)
573400
13.72 (0.540)
20.57 (0.810)
16.00 (0.630)
Recommended copper pad size
for heat sink and device mounting footprint
For D Pak (TO-263)
For MO-184 and SO-10
Recommended copper pad size
for heat sink and device mounting footprint
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