參數(shù)資料
型號： 505403B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 34/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 500
類型： 插件板級
冷卻式包裝： TO-3
固定方法： 把緊螺栓
形狀： 方形
長度： 1.780"（45.21mm）
寬： 1.780"（45.21mm）
機(jī)座外的高度（散熱片高度）： 1.250"（31.75mm）
溫升時(shí)的功耗： 7W @ 40°C
在強(qiáng)制氣流下的熱敏電阻： 在 600 LFM 時(shí)為1.5°C/W
自然環(huán)境下的熱電阻： 6°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 001282
24
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.3
(0.05)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
25
0
20
40
60
80
100
0.0
0.5
1.0
1.5
2.0
2.5
20
15
5
10
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
ORDERING INFORMATION
1.3
(0.05)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.37
(0.290)
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
7106
Surface mount heat sink for D
2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 25 for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Refer to Figure C on page 26 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
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參數(shù)描述
505403B00100G 功能描述:散熱片 TO-3 SQ BSKT B/A 45.21 X 31.75 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
505403B00400G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風(fēng)扇，熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標(biāo)準(zhǔn)包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類（BGA，LGA，CPU，ASIC……） 固定方法:散熱帶，粘合劑（含） 形狀:方形，鰭片 長度:1.21"（30.73mm） 寬:1.210"（30.73mm） 直徑:- 機(jī)座外的高度（散熱片高度）:0.355"（9.02mm） 溫升時(shí)的功耗:- 在強(qiáng)制氣流下的熱敏電阻:在 400 LFM 時(shí)為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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505403B30000 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
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